EP4CE75F23C7

The EP4CE75F23C7 is an Intel Cyclone® IV commercial-grade FPGA delivered in a 484-ball BGA package. It provides a high-density programmable fabric with 75,408 logic elements and extensive I/O for system-level integration.

Designed for applications that require substantial on-chip logic and embedded memory while operating from a low-voltage core supply, this device balances integration, I/O count, and a commercial operating temperature range to support board-level and prototype designs.

Key Features

• Logic Capacity  75,408 logic elements (LEs) organized across 4,713 LABs/CLBs, enabling sizable custom digital logic implementations.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Resources  292 user I/O pins to support multiple interfaces and board-level connectivity requirements.
• Core Voltage  Supports a 1.15 V to 1.25 V core supply range for the device core.
• Package and Mounting  484-ball fine-pitch BGA (484-FBGA, 23 × 23) in a surface-mount package for compact board integration.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.
• Documentation and Device Handbook  Detailed device handbook material covers operating conditions, DC and switching characteristics, power and thermal guidance, I/O standards, and transceiver/core performance specifications.

Typical Applications

• Custom digital logic and prototyping  Large logic capacity and flexible I/O make the device well suited for board-level prototyping and iterative hardware development.
• Memory-intensive embedded functions  The integrated ~2.81 Mbits of RAM supports buffering, packet queues, and lookup tables inside the FPGA fabric.
• I/O aggregation and protocol bridging  With 292 I/O pins, the device can be used to aggregate signals and implement protocol conversion or glue logic on a single chip.
• System-level control and glue logic  Dense logic resources enable implementation of complex control state machines and deterministic hardware functions.

Unique Advantages

• High logic integration: 75,408 logic elements allow complex designs to be implemented without partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 2.81 Mbits of embedded memory reduces external memory dependency for many buffering and LUT needs.
• Extensive I/O count: 292 user I/Os simplify board routing for multi-interface designs and reduce the need for external multiplexing.
• Compact BGA package: 484-FBGA (23 × 23) provides a space-efficient footprint suitable for high-density PCBs.
• Commercial operating range: Rated 0 °C to 85 °C for applications requiring standard commercial temperature performance.
• Standards-compliant supply: Operates from a 1.15 V–1.25 V core supply consistent with Cyclone IV device requirements.

Why Choose EP4CE75F23C7?

The EP4CE75F23C7 Cyclone IV FPGA provides a balance of high logic density, significant embedded memory, and broad I/O capability in a compact 484-BGA footprint. Its commercial temperature rating and RoHS compliance make it a practical choice for board-level designs and prototyping where integration and device-level resources reduce BOM complexity.

This device is ideal for engineering teams implementing sizable custom logic, memory-buffered functions, or multi-interface glue logic who need a proven FPGA architecture with comprehensive device documentation and electrical characterization provided in the Cyclone IV handbook.

Request a quote or submit an inquiry to receive pricing and availability for EP4CE75F23C7 and to discuss how this FPGA can fit into your next design.