EP4CE75F29C7

The EP4CE75F29C7 is a Cyclone® IV E field programmable gate array (FPGA) from Intel designed for commercial electronic systems. It delivers 75,408 logic elements and approximately 2.81 Mbits of embedded memory in a high-density package to support complex programmable logic implementations.

With 426 available I/Os, a 780-FBGA (29×29) surface-mount package, a low-voltage core supply (1.15 V to 1.25 V) and a commercial operating temperature range of 0 °C to 85 °C, this device is targeted at designs requiring significant logic capacity and flexible system integration.

Key Features

• Core Logic — 75,408 logic elements for implementing complex custom logic, state machines, and programmable functions.
• Embedded Memory — Approximately 2.81 Mbits of on-chip RAM to support buffering, FIFOs, and local storage without external memory.
• I/O Density — 426 I/O pins to enable broad interface support and system connectivity.
• Power — Core voltage supply range of 1.15 V to 1.25 V to match low-voltage system requirements.
• Package & Mounting — 780-FBGA package (29×29) in a surface-mount form factor for high-density board layouts.
• Operating Range & Grade — Commercial grade operation from 0 °C to 85 °C for standard commercial environments.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Systems — Implement custom control logic, interface bridging and programmable peripherals in commercial embedded products.
• Communications Equipment — Provide flexible I/O and logic resources for protocol bridging, packet processing, and control functions.
• Industrial Automation — Enable configurable logic for machine control, sequencing, and I/O aggregation in commercial automation systems.
• Prototyping and Development — Support hardware validation and proof-of-concept designs that require substantial programmable logic and on-chip memory.

Unique Advantages

• High Logic Capacity: 75,408 logic elements allow implementation of large, complex designs without immediate reliance on external logic.
• Substantial On‑Chip Memory: Approximately 2.81 Mbits of embedded RAM reduces dependence on external memory for buffers and temporary storage.
• Broad I/O Support: 426 I/Os enable direct interfacing to multiple peripherals, buses, and mezzanine connectors.
• Compact, High‑Density Package: 780-FBGA (29×29) surface-mount package supports dense PCB layouts and system miniaturization.
• Low‑Voltage Core: 1.15–1.25 V supply supports integration into modern low-voltage power architectures.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for reliable operation across standard commercial environments.

Why Choose EP4CE75F29C7?

The EP4CE75F29C7 positions itself as a high-capacity Cyclone IV E FPGA option for commercial designs that need significant programmable logic, on-chip RAM, and extensive I/O in a compact package. Its combination of 75,408 logic elements, approximately 2.81 Mbits of embedded memory, and 426 I/Os makes it suitable for systems where board-level integration and flexible interfacing are priorities.

Engineers and designers seeking a commercially rated FPGA with a dense BGA package and low-voltage core operation will find this device appropriate for a range of programmable-logic tasks. Its RoHS compliance and surface-mount 780-FBGA form factor support modern manufacturing and assembly processes.

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