EP4CE6E22C9L
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 276480 6272 144-LQFP Exposed Pad |
|---|---|
| Quantity | 1,511 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 91 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 392 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of EP4CE6E22C9L – Cyclone® IV E Field Programmable Gate Array (FPGA)
The EP4CE6E22C9L is a Cyclone IV E family FPGA in a 144-LQFP exposed pad package designed for commercial-grade applications. It integrates 6,272 logic elements, 276,480 bits of on-chip RAM and 91 I/O to deliver moderate logic density and flexible I/O connectivity in a compact surface-mount package.
With a core supply range of 0.970 V to 1.030 V and an operating temperature range of 0 °C to 85 °C, this device is suited to commercial embedded designs where compact form factor, measured on-chip memory and reliable I/O count are key considerations. The device handbook provides detailed specifications for operating conditions, DC and switching characteristics, and power consumption.
Key Features
- Logic Capacity — 6,272 logic elements provide the programmable fabric for moderate-density digital designs and custom logic implementation.
- On-Chip Memory — 276,480 total RAM bits (approximately 0.276 Mbits) of embedded memory to support buffers, FIFOs and small data storage needs.
- I/O Count — 91 user I/O pins for interfacing with peripherals, sensors and external controllers.
- Package and Mounting — 144-LQFP exposed pad (supplier package 144-EQFP, 20 × 20) in a surface-mount package for compact PCB layouts and improved thermal path through the exposed pad.
- Power — Core voltage specified from 0.970 V to 1.030 V for predictable supply planning and power budgeting.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation to match typical commercial embedded environments.
- Compliance — RoHS-compliant manufacturing to support regulatory and environmental considerations.
- Documentation — Supported by the Cyclone IV device handbook covering operating conditions, absolute maximum ratings, DC characteristics, switching characteristics and power consumption for system-level design.
Typical Applications
- Commercial Embedded Systems — Implement custom logic, interfaces and glue logic in compact consumer or industrial-control products that operate within a 0 °C to 85 °C range.
- User Interface and Control — Handle control, timing and peripheral interfacing using available I/O and on-chip memory for buffering UI data streams.
- Sensor Aggregation and Preprocessing — Aggregate multiple sensor inputs and perform deterministic preprocessing or protocol adaptation using the FPGA fabric and 91 I/O pins.
Unique Advantages
- Balanced Logic and Memory — 6,272 logic elements paired with 276,480 bits of RAM provide a practical balance for mid-range programmable tasks without requiring larger devices.
- Compact, Thermally Considerate Package — 144-LQFP with an exposed pad enables compact PCB footprints while offering a thermal return path for board-level cooling strategies.
- Predictable Power Planning — Defined core voltage window (0.970 V–1.030 V) simplifies supply design and integration into existing power rails.
- High I/O Availability — 91 I/O pins reduce the need for external multiplexing or expanders in many interface-heavy designs.
- Commercial-Grade Qualification — Rated for 0 °C to 85 °C operation to match standard commercial product requirements.
- RoHS Compliance — Environmentally compliant manufacturing supports product-level regulatory needs.
Why Choose EP4CE6E22C9L?
The EP4CE6E22C9L provides a measured combination of programmable logic, embedded RAM and I/O in a compact 144-LQFP exposed pad package for commercial applications. Its specified core voltage range and documented electrical and switching characteristics make it a practical choice for designers who need predictable integration into mid-density FPGA designs.
This device is appropriate for engineering teams delivering commercial embedded products that require on-chip memory, a substantial number of I/Os and a compact surface-mount package. Comprehensive device documentation is available to support design, validation and system-level integration.
Request a quote or submit an RFQ for the EP4CE6E22C9L to check availability and pricing for your next design.

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