EP4CE6E22C8N

IC FPGA 91 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 276480 6272 144-LQFP Exposed Pad

Quantity 710 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O91Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs392Number of Logic Elements/Cells6272
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of EP4CE6E22C8N – Cyclone® IV E Field Programmable Gate Array (FPGA) IC, 6,272 Logic Elements, 91 I/Os, 144-LQFP Exposed Pad

The EP4CE6E22C8N is an Intel Cyclone® IV E FPGA delivering 6,272 logic elements and approximately 0.276 Mbits of embedded RAM in a compact 144-LQFP exposed-pad package. It is specified for commercial-grade applications and supports a core supply voltage range of 1.15 V to 1.25 V with an operating temperature range of 0 °C to 85 °C.

This device is suited for designers who need configurable digital logic with moderate on-chip memory and a 91-pin I/O count in a surface-mount LQFP form factor. Comprehensive documentation is available in the Cyclone IV device handbook and device datasheet, which detail operating conditions, DC and switching characteristics, power consumption and I/O specifications.

Key Features

  • Core Logic — 6,272 logic elements providing the configurable logic capacity for medium-complexity designs.
  • Embedded Memory — 276,480 total RAM bits (approximately 0.276 Mbits) for on-chip buffering, state storage and small data tables.
  • I/O — 91 user I/O pins to support peripheral interfacing and signal routing.
  • Power — Core supply voltage specified from 1.15 V to 1.25 V to match system power budgets.
  • Package and Mounting — 144-LQFP exposed-pad package (supplier device package: 144-EQFP, 20 × 20); surface-mount mounting type for PCB assembly.
  • Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance and Documentation — RoHS-compliant device backed by detailed Cyclone IV device handbook and datasheet covering operating conditions, absolute maximum ratings, DC characteristics, switching characteristics, power consumption, I/O standards and ESD performance.

Typical Applications

  • Commercial embedded systems — Implement custom digital logic and peripheral control where moderate logic capacity and on-chip RAM are required.
  • Prototyping and proof-of-concept designs — Evaluate and iterate custom logic functions using a mid-range FPGA with accessible I/O and compact packaging.
  • Digital interfacing and control — Manage signal interfacing, simple protocol handling and glue-logic tasks using the device's I/O resources and embedded memory.

Unique Advantages

  • Balanced logic and memory — 6,272 logic elements paired with ~0.276 Mbits of RAM supports a wide range of medium-complexity functions without external memory.
  • Sized for compact PCBs — 144-LQFP exposed-pad surface-mount package offers a small footprint and PCB-friendly mounting for space-constrained designs.
  • Flexible I/O count — 91 I/Os accommodate multiple peripherals and interfaces without excessive external glue logic.
  • Controlled power envelope — Narrow core voltage range (1.15 V–1.25 V) simplifies power-supply planning for the FPGA core.
  • Commercial-grade reliability and compliance — Device grade is commercial and the part is RoHS compliant to meet environmental requirements.
  • Detailed technical reference — The Cyclone IV device handbook and datasheet provide in-depth specifications for integration, characterization and system design.

Why Choose EP4CE6E22C8N?

The EP4CE6E22C8N positions itself as a compact, commercially graded Cyclone IV E FPGA option for designs that need a moderate amount of configurable logic, embedded RAM and a practical I/O count in a 144-LQFP exposed-pad package. Its documented operating and electrical characteristics help engineers plan power, thermal and signal integrity considerations for reliable system integration.

This part is appropriate for hardware engineers and system designers building commercial embedded products, prototypes, or control/interface logic where on-chip resources and a small-footprint surface-mount package are priorities. The availability of comprehensive device documentation supports efficient development and qualification within commercial product timelines.

If you would like pricing, availability, or to request a formal quote for EP4CE6E22C8N, submit an inquiry to obtain detailed purchase information and next steps.

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