EP4CE55F29I8L

The EP4CE55F29I8L is a Cyclone® IV E family FPGA in a 780-ball FBGA package, offering a balance of programmable logic capacity, on-chip memory, and a high I/O count in an industrial-grade device. It is supplied in a 780-FBGA (29×29) surface-mount package and is manufactured by Intel.

This device is targeted at designs requiring substantial programmable logic and embedded memory with robust operating conditions: it supports a core voltage range of 0.970 V to 1.03 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic Capacity — Approximately 55,856 logic elements and 3,491 logic blocks, enabling complex custom digital designs and parallel processing implementations.
• Embedded Memory — Approximately 2.4 Mbits of on-chip RAM for buffering, state storage, and on-chip data structures.
• I/O and Package — 374 user I/Os provided in a 780-FBGA (29×29) surface-mount package for dense board-level integration.
• Power Supply — Core voltage supply range of 0.970 V to 1.03 V to support low-voltage system architectures.
• Operating Range & Grade — Industrial grade device with an operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory Compliance — RoHS compliant for lead-free manufacturing and regulatory compatibility.

Typical Applications

• Custom Digital Logic and Prototyping — Implement and iterate complex hardware functions using the device’s high logic element count and embedded memory.
• Industrial Control and Automation — Use the industrial operating temperature range and extensive I/O to interface with sensors, actuators, and control devices.
• High-Density I/O Systems — Leverage 374 I/Os and the compact 780-FBGA package for board-level systems that require many parallel interfaces.

Unique Advantages

• High Logic Density: Approximately 55,856 logic elements support complex, resource-intensive custom logic implementations without external glue logic.
• Substantial On-Chip Memory: Approximately 2.4 Mbits of embedded RAM reduces the need for external memory for many buffering and state-storage tasks.
• Extensive I/O in a Compact Package: 374 I/Os in a 780-FBGA (29×29) surface-mount package enable dense system integration while maintaining board space efficiency.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C, suitable for demanding environmental conditions and continuous operation.
• Low-Voltage Core Support: Core operation from 0.970 V to 1.03 V accommodates low-voltage system designs and modern power domains.
• RoHS Compliant: Facilitates lead-free manufacturing and regulatory conformity in many regions.

Why Choose EP4CE55F29I8L?

The EP4CE55F29I8L delivers a balanced combination of logic capacity, embedded memory, and high I/O density in an industrial-grade Cyclone IV E FPGA package from Intel. Its specification set—approximately 55,856 logic elements, roughly 2.4 Mbits of on-chip RAM, 374 I/Os, and a 780-FBGA (29×29) form factor—makes it suitable for engineers building complex programmable logic solutions that must operate across a wide temperature range.

This device is appropriate for teams needing scalable programmable logic for prototyping, system integration, and industrial applications where operating range, integration density, and regulatory compliance are important considerations.

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