EP4CE55F29C9LN

The EP4CE55F29C9LN is an Intel Cyclone® IV E field programmable gate array (FPGA) offered in a 780-FBGA (29×29) surface-mount package. It integrates 55,856 logic elements and approximately 2.4 Mbits of on-chip RAM to support complex digital functions and embedded memory requirements.

Designed for commercial-grade systems, this device provides a high I/O count and a tightly specified core voltage range, making it suitable for designs that require substantial logic density, flexible I/O routing, and compact packaging.

Key Features

• Core Logic  55,856 logic elements to implement custom digital logic, state machines, and parallel datapaths.
• Embedded Memory  Approximately 2.4 Mbits of on-chip RAM for buffering, FIFOs, and small on-chip data storage.
• I/O Capability  374 general-purpose I/Os to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
• Power and Voltage  Specified core voltage range of 0.970 V to 1.03 V to match system power rails and enable predictable power budgeting.
• Package & Mounting  780-FBGA (29×29) / 780-BGA package in a surface-mount form factor for high-density PCB designs.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.
• RoHS Compliance  RoHS-compliant manufacturing status for regulatory and assembly compatibility.

Typical Applications

• High-density digital logic  Implement complex custom logic, pipelined datapaths, and control state machines using the device's 55,856 logic elements.
• On-chip buffering and data handling  Leverage approximately 2.4 Mbits of embedded RAM for packet buffering, small caches, and FIFO implementations.
• Multi-interface systems  Use the 374 I/Os to connect wide parallel buses, multiple peripherals, or mixed-signal interface circuits on a single PCB.

Unique Advantages

• High logic capacity: 55,856 logic elements enable substantial on-chip implementation of combinational and sequential logic without immediate external logic.
• Integrated embedded memory: Approximately 2.4 Mbits of RAM reduces dependence on external memory for small to medium buffering tasks.
• Large I/O count: 374 I/Os simplify board design by supporting numerous direct connections to sensors, controllers, and peripherals.
• Compact BGA packaging: The 780-FBGA (29×29) footprint delivers high pin density in a surface-mount package suitable for space-constrained PCBs.
• Predictable power envelope: A narrow core voltage window (0.970 V to 1.03 V) helps with power supply selection and thermal planning.
• Commercial-grade operation: Rated for 0 °C to 85 °C to match typical commercial system environments.

Why Choose EP4CE55F29C9LN?

The EP4CE55F29C9LN positions itself as a capable Cyclone IV E FPGA option where a balance of logic density, embedded memory, and a high number of I/Os is required in a compact BGA package. Its commercial temperature rating and RoHS compliance make it well suited for mainstream electronics and embedded designs.

This device is appropriate for engineers and procurement teams seeking a scalable FPGA building block that combines substantial on-chip resources with a compact 780-FBGA footprint and clearly specified electrical and thermal operating windows.

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