EP4CE55F29C9L

The EP4CE55F29C9L is a Cyclone® IV E field programmable gate array (FPGA) IC from Intel, provided in a 780-ball fine-pitch BGA (29×29) package for surface-mount assembly. This commercial-grade device delivers a balance of logic capacity, embedded memory, and I/O resources suited to a wide range of commercial embedded designs.

Designed for applications that require programmable logic, significant on-chip RAM, and a high I/O count, the device combines a low-voltage core supply range with a compact package to support dense board integration and reliable commercial-temperature operation.

Key Features

• Logic Capacity — 55,856 logic elements and 3,491 logic blocks provide substantial programmable fabric for glue logic, custom state machines, and mid-density processing.
• Embedded Memory — Approximately 2.4 Mbits of on-chip RAM to support buffers, FIFOs, and small working sets without external memory.
• I/O Resources — 374 user I/O pins to accommodate wide parallel interfaces, multiple peripherals, and high-pin-count connectivity.
• Package — 780-FBGA (29×29) surface-mount package (780-BGA) for compact board footprint and robust soldered mounting.
• Power — Core supply range of 0.970 V to 1.03 V for compatibility with low-voltage system domains.
• Operating Range — Commercial temperature rating with specified operation from 0 °C to 85 °C.
• Compliance — RoHS-compliant device suitable for environmentally conscious commercial production.
• Documentation — Detailed Cyclone IV device handbook and datasheet sections covering operating conditions, DC characteristics, switching characteristics, and transceiver performance.

Typical Applications

• Commercial Embedded Systems — Implement control logic, protocol handling, and configurable interfaces in mid-range embedded products operating in commercial environments.
• Interface Bridging & Glue Logic — Use the device’s dense I/O and programmable fabric to bridge peripherals, implement bus adapters, and consolidate discrete logic components.
• Data Buffering & Signal Processing — Leverage approximately 2.4 Mbits of on-chip RAM for buffering, small FIFOs, and intermediate data storage in signal-processing pipelines.

Unique Advantages

• High Logic Density: 55,856 logic elements enable substantial implementation of custom digital functions without resorting to multiple devices.
• Generous On-Chip Memory: Approximately 2.4 Mbits of embedded memory reduces dependence on external RAM for many common buffering tasks.
• Extensive I/O: 374 I/O pins provide flexibility for wide parallel interfaces, multiple peripherals, and complex board-level connections.
• Compact, Robust Package: 780-FBGA (29×29) supports dense PCB layouts while maintaining a secure surface-mount attachment for production assemblies.
• Commercial Temperature and RoHS Compliance: Optimized for commercial-grade products with documented operating range and environmental compliance.
• Comprehensive Documentation: Supported by the Cyclone IV device handbook covering operating conditions, electrical characteristics, and performance parameters to aid design and validation.

Why Choose EP4CE55F29C9L?

The EP4CE55F29C9L positions itself as a flexible, mid-density Cyclone IV E FPGA option for commercial embedded designs that demand a mix of logic capacity, embedded RAM, and a high count of I/O pins in a compact BGA package. Its documented electrical and operating information supports predictable integration into production designs.

This device is well suited to engineers and procurement teams developing commercial products that require configurable logic, interface consolidation, and on-chip buffering while maintaining a small board footprint and RoHS compliance.

Request a quote or submit a product inquiry to discuss availability, pricing, and lead times for EP4CE55F29C9L.