EP4CE55F29C8LN

The EP4CE55F29C8LN is a Cyclone® IV Field Programmable Gate Array (FPGA) IC manufactured by Intel, supplied in a 780-FBGA (29×29) surface-mount package. Designed for commercial-grade applications, the device delivers a high logic capacity and substantial embedded memory with a broad set of I/O resources.

This device targets commercial electronic designs that require reprogrammable logic, flexible interfacing, and on-chip memory while operating within a 0 °C to 85 °C range and a core supply between 970 mV and 1.03 V.

Key Features

• Logic Capacity — Provides 55,856 logic elements (LEs) to implement complex, reconfigurable logic and control functions.
• Embedded Memory — Approximately 2.396 Mbits of on-chip RAM to support buffering, state machines, and data processing without external memory.
• I/O Density — 374 user I/O pins for broad interface compatibility and high-pin-count designs.
• Package & Mounting — 780-FBGA (29×29) package in a surface-mount format for compact, high-density board implementations.
• Power Supply — Core voltage range specified from 970 mV to 1.03 V, enabling predictable power provision for the FPGA fabric.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Compliance — RoHS-compliant device to meet common environmental regulations for electronic assemblies.
• Documented Device Handbook — Device handbook and datasheet content provide detailed operating conditions, absolute maximum ratings, DC characteristics, switching characteristics, power consumption, and other device-level specifications.

Typical Applications

• Commercial Embedded Systems — Use the EP4CE55F29C8LN for programmable control, custom logic partitioning, and interface glue logic in commercial electronics.
• Data Buffering and Processing — Leverage the approximately 2.396 Mbits of embedded RAM for on-chip buffering, FIFOs, and temporary data storage.
• High-Density I/O Solutions — 374 I/O pins support designs that require multiple parallel interfaces, sensor arrays, or wide data buses.

Unique Advantages

• High Logic Integration: 55,856 logic elements let you consolidate multiple functions into a single FPGA, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 2.396 Mbits of RAM enables local data handling and reduces reliance on external memory devices.
• Robust I/O Capability: 374 I/O pins provide flexibility for complex interfacing and multiple concurrent peripheral connections.
• Compact, High-Density Package: 780-FBGA (29×29) surface-mount package supports space-constrained designs while maintaining high pin count.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant to align with typical commercial product requirements.
• Detailed Technical Documentation: Device handbook and datasheet content are available for precise design planning, including electrical, thermal, and timing specifications.

Why Choose EP4CE55F29C8LN?

The EP4CE55F29C8LN provides a balanced combination of logic density, embedded memory, and extensive I/O in a compact 780-FBGA package for commercial applications. Its specified core voltage range and documented operating characteristics make it suitable for designers who need predictable, reconfigurable logic capacity without expanding board-level complexity.

This Cyclone® IV FPGA is appropriate for teams developing commercial embedded hardware that require on-chip memory and high I/O count, backed by comprehensive device handbook information to support implementation and verification efforts.

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