EP4CE55F29C7

The EP4CE55F29C7 is a Cyclone® IV field programmable gate array (FPGA) from Intel, offered in a 780-BGA surface-mount package. It provides a mid-range FPGA fabric intended for commercial applications that require substantial logic capacity, embedded memory, and a high I/O count.

With 55,856 logic elements, approximately 2.4 Mbits of on-chip RAM and 374 I/Os, this device is designed to support complex glue logic, protocol bridging, and multi-interface embedded designs while operating from a 1.15 V to 1.25 V core supply within a commercial temperature range.

Key Features

• Core Logic – 55,856 logic elements provide the programmable fabric to implement combinational and sequential logic for custom functions and accelerators.
• Embedded Memory – Approximately 2.4 Mbits of total on-chip RAM to store buffers, FIFOs, and working data sets for logic blocks and peripheral interfaces.
• I/O Density – 374 device I/O pins support wide parallel interfaces, multiple serial ports, and mixed-signal connectivity at the board level.
• Power and Voltage – Core supply voltage specified at 1.15 V to 1.25 V to match system power rails and support predictable power budgeting.
• Package and Mounting – 780-FBGA (29×29) package case in a 780-BGA format; surface-mount mounting for compact PCB layouts.
• Operating Range and Grade – Commercial grade with an operating temperature range of 0 °C to 85 °C to suit general-purpose embedded and industrial-adjacent electronics.
• Compliance – RoHS compliant to meet environmental and manufacturing requirements.
• Documentation – Supported by Cyclone IV device documentation and the Cyclone IV Device Handbook as provided in the vendor datasheet materials.

Typical Applications

• Commercial Embedded Systems – Implement board-level control, custom peripherals, and protocol logic using the device's logic capacity and I/O resources within commercial temperature environments.
• Interface Bridging and I/O Aggregation – Aggregate multiple interfaces or convert between protocols using abundant I/O and on-chip RAM for buffering.
• Prototyping and Evaluation Platforms – Use the FPGA fabric and memory to validate IP, system architectures, and firmware/hardware interactions before product release.
• Multi-Channel Data Handling – Support parallel data paths and intermediate buffering with the combination of large logic count and embedded RAM.

Unique Advantages

• High Logic Density: 55,856 logic elements enable implementation of substantial custom logic and state machines without immediate need to migrate to larger families.
• Significant On-Chip Memory: Approximately 2.4 Mbits of embedded RAM reduces external memory dependence for many buffering and FIFO requirements.
• Extensive I/O Count: 374 I/Os allow flexible board-level interfacing and support for multiple peripheral connections simultaneously.
• Compact, Surface-Mount Package: 780-FBGA (29×29) package supports high-density PCB layouts while keeping the device surface-mount compatible.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation, matching common commercial product environments.
• Standards and Compliance: RoHS compliance and vendor documentation (Cyclone IV Device Handbook) help streamline design and regulatory processes.

Why Choose EP4CE55F29C7?

The EP4CE55F29C7 positions itself as a mid-range Cyclone IV FPGA option for commercial applications that need a balance of logic capacity, embedded memory, and high I/O count in a compact 780-BGA package. Its specified core voltage range and documented device handbook support predictable integration into system designs.

This device is ideal for engineering teams developing commercial embedded systems, interface bridging solutions, and prototype platforms that benefit from a programmable fabric with substantial on-chip resources and thorough vendor documentation.

Request a quote or submit an inquiry to receive pricing and availability information for the EP4CE55F29C7 and to discuss how it can fit your next commercial FPGA design.