EP4CE55F23I8L

The EP4CE55F23I8L is an Intel Cyclone IV E field programmable gate array designed for industrial-grade embedded and control applications. It integrates 55,856 logic elements with approximately 2.4 Mbits of on-chip RAM and 324 general-purpose I/O to deliver flexible, high-density logic and memory resources in a compact 484‑BGA package.

With a core supply range of 970 mV to 1.03 V, surface-mount 484‑FBGA (23×23) packaging, and an operating temperature range of −40 °C to 100 °C, this device targets systems that require robust thermal tolerance and a high pin count for peripheral interfacing.

Key Features

• Core Logic – 55,856 logic elements provide extensive programmable logic capacity for custom control, glue logic, and moderate-complexity processing functions.
• Embedded Memory – Approximately 2.4 Mbits of on-chip RAM support buffering, FIFOs, and local data storage without external memory in many designs.
• I/O Density – 324 I/O pins enable broad peripheral and bus connectivity for sensors, actuators, and high‑pin-count interfaces.
• Power – Core voltage supply specified from 970 mV to 1.03 V to match system power delivery and core performance requirements.
• Package & Mounting – 484‑BGA (484‑FBGA, 23×23) surface-mount package balances high I/O count with a compact board footprint.
• Industrial Temperature Range – Rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Compliance – RoHS compliant for alignment with common environmental regulatory requirements.

Typical Applications

• Industrial Control & Automation – Industrial-grade temperature range and extensive I/O make the device suitable for control logic, sensor interfaces, and machine automation tasks.
• Embedded Systems – Large logic capacity and on-chip RAM enable custom processing, protocol bridging, and system glue logic in embedded platforms.
• Communications & Networking – High I/O count and dense logic resources support packet handling, interface adaptation, and peripheral aggregation.
• Signal Conditioning & I/O Expansion – On-chip memory and plentiful I/Os allow buffering, timing control, and expansion of digital I/O in mixed-signal systems.

Unique Advantages

• Significant Logic Capacity: 55,856 logic elements provide the headroom to implement multi-function logic, custom datapaths, and state machines without external ASICs.
• Integrated Memory Resources: Approximately 2.4 Mbits of embedded RAM reduce dependence on external memory, simplifying BOM and board layout.
• High I/O Count: 324 I/Os support extensive peripheral connectivity and multiple parallel interfaces on a single device.
• Industrial Temperature Support: Operation from −40 °C to 100 °C enables reliable use in harsh or thermally variable installations.
• Compact, High‑Pin Package: 484‑FBGA (23×23) packaging delivers high density in a surface-mount form factor suited for space-constrained PCBs.
• Regulatory Compatibility: RoHS compliance supports environmentally conscious product designs and procurement requirements.

Why Choose EP4CE55F23I8L?

The EP4CE55F23I8L balances substantial programmable logic, on-chip memory, and a large I/O complement in a compact industrial-grade 484‑BGA package. Its specified core voltage range and wide operating temperature band make it appropriate for embedded and control designs that require robust operation across varied environments.

This FPGA is well suited to engineers and procurement teams seeking a scalable, RoHS-compliant programmable device that consolidates logic, memory, and I/O to simplify board-level design and reduce component count while maintaining flexibility for mid-complexity implementations.

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