EP4CE55F29C6N

The EP4CE55F29C6N is a Cyclone IV E Field Programmable Gate Array (FPGA) IC designed for commercial embedded and digital-logic applications. It combines a moderate logic fabric with on-chip memory and extensive I/O to address designs that require configurable logic, memory resources, and board-level interfacing.

With 55,856 logic elements and approximately 2.4 Mbits of embedded memory, this device targets implementations that need substantial logic density and a high pin count while operating from a 1.15 V–1.25 V core supply in a compact 780-ball BGA package.

Key Features

• Logic Capacity — 55,856 logic elements for implementing complex combinational and sequential logic structures.
• Embedded Memory — Approximately 2.4 Mbits of on-chip RAM to support buffering, lookup tables, and local storage.
• I/O — 374 device I/Os to accommodate multiple interfaces and high pin-count connectivity requirements.
• Power — Core voltage supply range of 1.15 V to 1.25 V for the device core.
• Package & Mounting — Supplied in a 780-ball FBGA (29 × 29) format (780-BGA package case) suitable for surface-mount assembly.
• Operating Range — Commercial grade operating temperature from 0 °C to 85 °C.
• Compliance — RoHS-compliant device.
• Documentation — Supported by Cyclone IV device documentation and datasheet material for design guidance and electrical specifications.

Typical Applications

• Custom digital logic and prototyping — Implement glue logic, protocol conversion, and custom state machines using the device's logic elements and embedded RAM.
• High-density I/O bridging — Use the 374 I/Os to consolidate multiple board-level interfaces or adapt between peripheral standards.
• Embedded system controllers — Combine on-chip memory and logic to realize control functions, local buffering, and deterministic hardware processing.

Unique Advantages

• High integration density: 55,856 logic elements and ~2.4 Mbits of embedded memory reduce the need for external logic and memory components, simplifying system design.
• Extensive connectivity: 374 I/Os provide flexibility to interface with multiple peripherals and buses without additional interface chips.
• Compact surface-mount footprint: 780-FBGA (29 × 29) package enables a high-pin-count solution in a space-efficient package for dense board layouts.
• Low-voltage core: 1.15 V–1.25 V supply range aligns with modern low-voltage FPGA core requirements and power-rail planning.
• Commercial-grade operating range: Rated for 0 °C to 85 °C to suit a broad range of commercial and embedded applications.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP4CE55F29C6N?

The EP4CE55F29C6N positions itself as a capable Cyclone IV E FPGA solution for designers needing a balance of logic capacity, embedded memory, and substantial I/O in a compact BGA package. Its specification set makes it well suited to embedded digital designs, interface consolidation, and prototyping environments where commercial-grade operation and RoHS compliance are required.

Engineers and procurement teams looking for a documented FPGA device with verified electrical characteristics and package options will find this part appropriate for mid-density, I/O-rich implementations where integration and board-level flexibility matter.

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