EP4CE55F29I8LN

The EP4CE55F29I8LN is a Cyclone® IV E field programmable gate array (FPGA) provided in a 780‑ball FBGA package. It delivers a balance of programmable logic capacity, on‑chip memory, and I/O density intended for industrial applications that require configurable digital logic and robust operating range.

This device integrates 55,856 logic elements, approximately 2.4 Mbits of embedded memory, and 374 I/O pins in a 780‑BGA (29×29) surface‑mount package, enabling compact, high‑density designs with predictable supply and temperature requirements.

Key Features

• Logic Capacity  55,856 logic elements providing substantial programmable logic resources; organized across 3,491 logic blocks.
• Embedded Memory  Approximately 2.4 Mbits of total on‑chip RAM for buffering, FIFOs, and small lookup tables.
• I/O Density  374 general‑purpose I/O pins to interface directly with external peripherals, sensors, and high‑pin‑count boards.
• Core Voltage  Specified core supply range from 0.97 V to 1.03 V for defined power sequencing and supply design.
• Package & Mounting  780‑FBGA (29×29) package case in a surface‑mount form factor for high‑density PCB implementations.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
• Regulatory Status  RoHS compliant.

Typical Applications

• Industrial Control  Programmable logic for machine control, I/O aggregation, and customizable sequencing in harsh temperature environments.
• Communications & Networking  Protocol bridging, packet buffering, and interface adaptation using high I/O count and on‑chip RAM.
• Prototyping & Development  Platform for validating custom digital blocks and system integration where reprogrammability is required.
• Signal Processing  Deterministic, hardware‑level data manipulation using abundant logic elements and embedded memory.

Unique Advantages

• Broad Logic Resources: Large pool of 55,856 logic elements reduces the need for external PLD components and simplifies complex designs.
• Significant On‑Chip Memory: Approximately 2.4 Mbits of RAM supports buffering and local data storage without external memory overhang.
• High I/O Count: 374 I/O pins enable direct connection to multiple peripherals and dense board layouts, minimizing external IO expanders.
• Industrial‑Grade Operation: −40 °C to 100 °C rating supports deployment in elevated and wide temperature environments common in industrial systems.
• Compact, High‑Density Package: 780‑FBGA (29×29) surface‑mount package allows integration into space‑constrained PCBs while maintaining thermal and electrical performance.
• Clear Power Envelope: Defined core voltage range (0.97–1.03 V) simplifies power supply design and sequencing requirements.

Why Choose EP4CE55F29I8LN?

The EP4CE55F29I8LN positions itself as a scalable, industrial‑grade Cyclone IV FPGA that combines substantial logic capacity, meaningful embedded memory, and a high I/O count in a compact 780‑FBGA package. Its specified core voltage range and wide operating temperature make it suitable for applications requiring predictable power behavior and reliable operation across broad thermal conditions.

Engineers designing industrial control, communications, prototyping, or signal processing systems will find this device useful where reprogrammability, on‑chip resources, and board‑level density are priorities. The RoHS compliance and standard package options support long‑life production and integration into established manufacturing flows.

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