EP4CE55F23C8L

The EP4CE55F23C8L is a Cyclone® IV E field programmable gate array (FPGA) in a 484-ball fine-pitch BGA package. It provides a commercially graded, surface-mount programmable logic solution with a substantial logic capacity and on-chip memory for a wide range of commercial embedded designs.

Designed to support integration of custom logic, peripheral interfaces and memory-intensive functions, this device delivers 55,856 logic elements, approximately 2.4 Mbits of embedded RAM, and 324 user I/O pins while operating within a 0.97 V–1.03 V core supply window and a 0 °C–85 °C temperature range.

Key Features

• Core Logic Capacity — 55,856 logic elements for implementing complex programmable logic and custom hardware accelerators.
• Embedded Memory — Approximately 2.4 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip storage for data-path and control logic.
• I/O Density — 324 user I/O pins to support multiple parallel interfaces and external device connections.
• Package — 484-ball FBGA (23 × 23) package optimized for surface-mount assembly and high-density board designs.
• Power — Core supply range of 0.97 V to 1.03 V, enabling predictable power budgeting for the programmable core.
• Commercial Grade Temperature — Rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free, environmentally compliant designs.

Typical Applications

• Commercial Embedded Systems — Use programmable logic and on-chip memory for custom control, protocol conversion, or hardware acceleration in commercial devices.
• Data Path and Buffering — Leverage approximately 2.4 Mbits of embedded RAM for buffering, FIFOs, and intermediate data storage in communication or processing paths.
• Interface Bridging — High I/O count supports glue logic and interface bridging between multiple peripherals and subsystems on a single board.

Unique Advantages

• High Logic Density: 55,856 logic elements enable implementation of complex finite-state machines, custom accelerators, and multi-function logic in one device.
• Ample On-Chip Memory: Approximately 2.4 Mbits of embedded RAM reduces the need for external memory for many buffering and temporary storage tasks.
• Large I/O Count: 324 user I/Os provide flexibility for parallel interfaces, multiple peripherals, and board-level integration without extra interface chips.
• Compact Surface-Mount Package: 484-FBGA (23 × 23) package supports high-density PCB layouts while maintaining robust electrical connections.
• Commercial Temperature Rating: Designed for 0 °C to 85 °C operation to meet requirements of standard commercial products and deployments.
• Standards-Driven Documentation: Backed by detailed Cyclone IV device handbook and datasheet documentation for design, electrical and timing references.

Why Choose EP4CE55F23C8L?

The EP4CE55F23C8L positions itself as a commercially graded, high-capacity Cyclone IV E FPGA suitable for designers needing substantial programmable logic, embedded RAM, and a large I/O complement in a compact BGA package. Its defined core voltage window and commercial temperature rating make power and thermal planning straightforward for board-level designs.

This device is appropriate for teams building commercial embedded systems, interface converters, or data-path logic that benefit from on-chip memory and high I/O counts. Detailed device documentation is available to support design integration and qualification activities.

Request a quote or submit an inquiry to receive pricing and availability information for the EP4CE55F23C8L and to discuss how it can fit into your next commercial design.