EP4CE55F23C7

The EP4CE55F23C7 is a Cyclone IV E family FPGA in a 484-ball fine-pitch BGA package (484-FBGA, 23x23) designed for surface-mount applications. It provides a balance of on-chip logic, embedded memory and I/O capacity for programmable digital designs within commercial temperature ranges.

Device documentation is provided in the Cyclone IV Device Handbook, Volume 3, which details operating conditions, DC characteristics, power and switching specifications to support system integration and verification.

Key Features

• Logic Capacity — 55,856 logic elements that enable implementation of substantial custom digital logic and state machines.
• Embedded Memory — Approximately 2.4 Mbits of on-chip RAM for buffering, FIFOs and small data storage requirements.
• I/O Resources — 324 user I/O pins to support wide-ranging peripheral interfacing and parallel bus connections.
• Power Requirements — Core voltage supply range of 1.15 V to 1.25 V to match common FPGA power-rail architectures.
• Package and Mounting — 484-FBGA (23x23) package in a surface-mount form factor for compact PCB designs.
• Operating Range — Commercial temperature grade with specified operating range from 0 °C to 85 °C.
• Standards Compliance — RoHS compliant for regulatory and environmental adherence.

Typical Applications

• Custom Logic Acceleration — Use the device’s 55,856 logic elements to implement application-specific datapaths and control logic.
• On-Chip Buffering and Storage — Approximately 2.4 Mbits of embedded RAM supports packet buffering, FIFOs and small embedded datasets.
• High-Density I/O Systems — 324 I/O pins enable interfacing to multiple peripherals, parallel buses and mixed-signal front ends.

Unique Advantages

• High Logic Density: 55,856 logic elements provide the programmable capacity to consolidate multiple functions into a single device, reducing board-level component count.
• Significant On-Chip Memory: Approximately 2.4 Mbits of embedded RAM reduces external memory dependency for many buffering and state-storage needs.
• Extensive I/O: 324 I/O pins allow flexible connectivity for complex interfaces and mixed-signal systems without immediate need for expanders.
• Compact BGA Packaging: The 484-FBGA (23x23) package delivers high pin density in a compact footprint suitable for space-constrained layouts.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, matching many commercial and enterprise deployments.
• Regulatory Compliance: RoHS compliance aligns the device with common environmental sourcing requirements.

Why Choose EP4CE55F23C7?

The EP4CE55F23C7 positions itself as a versatile Cyclone IV E FPGA option for designers who need a blend of substantial logic resources, embedded RAM and broad I/O in a compact BGA package. Its documented operating and electrical characteristics in the Cyclone IV Device Handbook, Volume 3, support disciplined system integration and validation.

This device is well suited to development teams and procurement organizations seeking a programmable platform that consolidates logic, memory and interface needs into a single surface-mount component, while meeting commercial temperature and RoHS environmental requirements.

Request a quote or submit a pricing inquiry for EP4CE55F23C7 to evaluate availability and delivery for your next design.