EP4CE55F23C8N

The EP4CE55F23C8N is an Intel Cyclone® IV E field programmable gate array (FPGA) supplied in a 484-ball fine-pitch BGA (23×23) surface-mount package. It delivers a substantial programmable logic resource with 55,856 logic elements and approximately 2.4 Mbits of on-chip RAM, making it suitable for designs that require medium-density logic, on-chip memory, and a large number of I/O.

Targeted at commercial-grade applications, this device supports a wide range of digital integration tasks where I/O count, embedded memory, and power-rail compatibility (1.15–1.25 V core supply) are key design drivers.

Key Features

• Programmable Logic Capacity — 55,856 logic elements to implement custom digital functions and complex state machines.
• Embedded Memory — Approximately 2.4 Mbits of total on-chip RAM for buffering, lookup tables, and temporary storage.
• I/O Density — 324 user I/O pins to support multiple interfaces and high-pin-count system designs.
• Package & Mounting — 484-ball FBGA (23×23) package, surface-mount for compact PCB integration.
• Supply Voltage — Core voltage range 1.15 V to 1.25 V to match common FPGA power architectures.
• Operating Temperature — Commercial-grade operation from 0 °C to 85 °C for standard environmental conditions.
• Regulatory — RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Conversion — High I/O count and abundant logic elements support custom bus bridging and protocol translation tasks.
• Embedded System Control — On-chip memory and programmable logic enable implementation of control algorithms, state machines, and peripheral management.
• Board-Level Integration and Prototyping — Compact 484-FBGA package and surface-mount mounting make the device suitable for dense PCB layouts and system prototypes.

Unique Advantages

• Substantial Logic Resources: 55,856 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing external components.
• Integrated On-Chip RAM: Approximately 2.4 Mbits of embedded memory lowers the need for external memory in many buffering and temporary-storage use cases.
• High I/O Count: 324 I/O pins allow flexible interfacing to peripherals and multiple parallel buses without complex multiplexing.
• Compact Packaging: 484-FBGA (23×23) enables high-density PCB designs while maintaining manufacturability with surface-mount assembly.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lifecycles.

Why Choose EP4CE55F23C8N?

The EP4CE55F23C8N balances sizable programmable logic, embedded memory, and high I/O in a compact 484-FBGA package, making it a practical choice for designers consolidating multiple digital functions onto a single FPGA. Its 1.15–1.25 V core supply range and commercial operating temperature rating align with common system power and environmental requirements.

This device is well-suited for engineering teams building mid-density FPGA-based solutions—where logic capacity, on-chip RAM, and interface flexibility matter—backed by Intel’s Cyclone IV E device family specifications and documentation.

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