EP4CE40F29I8LN

The EP4CE40F29I8LN is an Intel Cyclone® IV E Field Programmable Gate Array (FPGA) supplied in a 780-ball BGA package. It delivers a high-density programmable logic fabric with on-chip memory, a large I/O count, and industrial-grade operating range for designs that require extensive programmable logic and I/O integration.

Key hardware characteristics include approximately 39,600 logic elements, roughly 1.16 Mbits of embedded RAM, up to 532 I/O pins, a 780-FBGA (29×29) package, and an operating range from −40 °C to 100 °C. The device operates from a core supply range of about 0.97 V to 1.03 V and is RoHS compliant.

Key Features

• Core Architecture  Cyclone IV E FPGA architecture in the EP4CE40F29I8LN provides a programmable logic fabric suitable for complex digital designs.
• Logic Capacity  Approximately 39,600 logic elements and 2,475 logic array blocks give designers substantial combinational and sequential logic resources.
• Embedded Memory  Approximately 1.16 Mbits of on-chip RAM supports data buffering, FIFOs, and small memory-mapped functions without external RAM.
• I/O and Packaging  Up to 532 I/O pins in a 780-FBGA (29×29) footprint enable dense connectivity; the device uses surface-mount assembly.
• Power and Supply  Core supply specified between 0.97 V and 1.03 V for predictable operating conditions and power planning.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for systems requiring extended temperature range.
• Compliance  RoHS compliant for regulatory and environmental compatibility.
• Documentation Coverage  The Cyclone IV device handbook (series datasheet) provides detailed sections on operating conditions, DC characteristics, switching characteristics, and transceiver performance specifications for design reference.

Typical Applications

• Industrial Control  Industrial-grade temperature rating and a high I/O count support control, sensing, and interface aggregation in factory automation and process control equipment.
• Communications Equipment  Large I/O capacity and device-level transceiver performance coverage in the Cyclone IV documentation enable implementation of custom interface logic and protocol bridging.
• Prototyping and Custom Logic  Significant logic density and embedded RAM make the device suitable for hardware prototyping and bespoke digital accelerators where on-chip resources reduce external BOM.

Unique Advantages

• High Logic Density: Approximately 39,600 logic elements provide the capacity to implement complex state machines, datapaths, and glue logic within a single FPGA.
• Substantial On-Chip Memory: Around 1.16 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks, simplifying system design.
• Extensive I/O Count: 532 I/O pins in a 780-FBGA package enable high connector density and flexible pin assignments for multi-interface applications.
• Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact BGA Package: The 780-FBGA (29×29) surface-mount package balances high density with a PCB footprint suitable for compact system boards.
• Standards-Friendly Compliance: RoHS compliance helps meet environmental requirements in many production programs.

Why Choose EP4CE40F29I8LN?

The EP4CE40F29I8LN positions itself as a balanced, industrial-grade Cyclone IV E FPGA offering significant logic resources, on-chip RAM, and a large I/O complement in a single 780-BGA footprint. Its documented electrical and performance characteristics in the Cyclone IV handbook give design teams the technical detail needed for power budgeting, timing analysis, and I/O planning.

This device suits teams building dense, custom digital logic solutions—especially where board-level I/O density and extended temperature operation are required. The combination of logic capacity, embedded memory, and package-level connectivity delivers a scalable hardware resource for mid-range FPGA designs backed by series documentation.

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