EP4CE40F23I7N

The EP4CE40F23I7N is a Cyclone® IV E field programmable gate array (FPGA) from Intel, offered in a 484-FBGA (23×23) surface-mount package. It delivers a balanced combination of logic capacity, embedded memory, and I/O density for industrial-grade embedded designs.

With 39,600 logic elements, approximately 1.16 Mbits of on-chip RAM and 328 I/O pins, this device is suited to applications that require configurable digital logic, substantial local memory, and broad external connectivity within an industrial temperature range.

Key Features

• Core Architecture: Cyclone IV E FPGA family from Intel, documented in the Cyclone IV Device Handbook for device-level specifications and design guidance.
• Logic Capacity: 39,600 logic elements to implement complex custom logic, state machines and glue-logic functions.
• Embedded Memory: Approximately 1.16 Mbits of embedded RAM for buffering, FIFOs, and on-chip data storage.
• I/O Resources: 328 user I/O pins to support wide parallel interfaces and diverse peripheral connections.
• Package & Mounting: 484-FBGA (23×23) package, surface-mount mounting type for compact board integration.
• Power Supply: Core voltage range 1.15 V to 1.25 V to match target system power architectures.
• Industrial Temperature Grade: Rated for operation from −40 °C to 100 °C for use in temperature-demanding environments.
• Compliance: RoHS compliant for regulatory and environmental compatibility.

Typical Applications

• Industrial Control: Deploy configurable logic, I/O handling and local memory within industrial temperature ranges for automation and control systems.
• Embedded Systems: Implement custom processing blocks, interfaces and peripheral glue logic using the device’s logic elements and on-chip RAM.
• I/O-Intensive Designs: Support parallel sensors, buses and external devices with 328 available I/O pins.

Unique Advantages

• High Logic Density: 39,600 logic elements enable implementation of sizable custom logic functions without external CPLDs.
• On-Chip Memory: Approximately 1.16 Mbits of embedded RAM reduces reliance on external memory for many buffering and data-path needs.
• Broad I/O Capability: 328 I/O pins support multiple interfaces and peripheral connections on a single device.
• Industrial Temperature Range: Operation from −40 °C to 100 °C allows deployment in temperature-variable environments.
• Compact BGA Footprint: 484-FBGA (23×23) package balances high pin count with a compact PCB footprint.
• Regulatory Compatibility: RoHS compliance aligns with environmental and manufacturing requirements.

Why Choose EP4CE40F23I7N?

The EP4CE40F23I7N positions itself as a reliable, industrial-grade Cyclone IV E FPGA option when you need a mix of substantial logic resources, embedded memory and a high I/O count in a compact BGA package. Its documented device specifications in the Cyclone IV Device Handbook and Intel platform pedigree provide the technical detail designers rely on for system-level integration.

This device is well suited to teams building embedded and industrial applications that require configurable logic, moderate on-chip RAM and robust I/O capability while operating across a wide temperature range.

If you would like pricing, availability, or a formal quote for EP4CE40F23I7N, submit a request to receive details and lead-time information.