EP4CE40F23I7

IC FPGA 328 I/O 484FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 1161216 39600 484-BGA

Quantity 977 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O328Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of EP4CE40F23I7 – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 1161216 39600 484-BGA

The EP4CE40F23I7 is an Intel Cyclone® IV E field programmable gate array (FPGA) supplied in a 484-ball BGA package for surface-mount applications. It provides a balance of programmable logic capacity, on-chip memory, and I/O density intended for industrial and embedded designs.

With substantial logic resources and on-chip RAM, the device addresses applications that require flexible hardware acceleration, high-density I/O interfacing, and operation across an extended industrial temperature range while maintaining a low core-voltage domain.

Key Features

  • Core Logic  Provides 39,600 logic elements and 2,475 logic blocks to implement custom digital functions and state-machine logic.
  • Embedded Memory  Approximately 1.16 Mbits of on-chip RAM for buffering, FIFOs, and small data stores close to logic resources.
  • I/O Density  Up to 328 I/O pins to support wide parallel interfaces, multiple buses, and mixed-signal front-end connections.
  • Power  Core supply range specified from 1.15 V to 1.25 V for the programmable logic domain.
  • Package & Mounting  484-FBGA (23 × 23) package, surface-mount mounting type, offering a compact footprint for high-density board designs.
  • Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for a wide range of temperature-challenged environments.
  • Compliance  RoHS-compliant for regulated environmental requirements.
  • Datasheet and Technical Coverage  Detailed device handbook coverage includes operating conditions, DC characteristics, switching characteristics, and power consumption guidance.

Typical Applications

  • Industrial control systems  Use the device’s industrial temperature rating and high I/O count for sensor aggregation, actuator interfacing, and real-time control logic.
  • Embedded processing and acceleration  Deploy on-chip logic and approximately 1.16 Mbits of RAM for custom accelerators, protocol handling, and deterministic processing tasks.
  • I/O expansion and protocol bridging  Leverage 328 I/Os and abundant logic resources to implement bus bridging, parallel-to-serial conversion, and custom interface logic.
  • Prototyping and custom digital IP  The combination of logic capacity and memory enables rapid hardware prototyping and integration of bespoke digital functions.

Unique Advantages

  • High logic capacity: 39,600 logic elements support sizeable custom logic implementations without immediate escalation to larger device families.
  • Substantial on-chip RAM: Approximately 1.16 Mbits of embedded memory reduces external memory dependency for buffering and local data storage.
  • Large I/O complement: 328 I/Os provide flexibility to connect multiple peripherals, sensors, and buses directly to the FPGA fabric.
  • Industrial temperature capability: Rated from −40 °C to 100 °C to meet the demands of temperature-variable field deployments.
  • Compact BGA packaging: 484-FBGA (23 × 23) balances pin count and board space for dense, manufacturable designs.
  • RoHS compliance: Supports regulatory requirements for environmentally conscious product designs.

Why Choose EP4CE40F23I7?

The EP4CE40F23I7 positions itself as a versatile Cyclone IV E FPGA option that combines a substantial logic element count, meaningful embedded memory, and a large number of I/Os within an industrial-grade temperature window. It is well suited for designers who need a programmable, high-I/O device for industrial or embedded applications where board space and thermal range are key considerations.

Backed by comprehensive device documentation covering operating conditions, electrical characteristics, and switching behavior, the part supports informed design decisions and predictable system integration for mid-density FPGA implementations.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for the EP4CE40F23I7. Our team can provide the documentation and ordering support you need to evaluate this Cyclone IV E FPGA for your next design.

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