EP4CE40F23C8LN

The EP4CE40F23C8LN is a Cyclone® IV E family FPGA from Intel, provided in a 484-ball BGA package for surface-mount applications. It integrates a high-density fabric with approximately 39,600 logic elements, around 1.16 Mbits of embedded RAM, and 328 general-purpose I/O to support complex, reconfigurable digital designs.

Designed for commercial-grade electronics, the device targets applications that require dense logic, significant on-chip memory, and flexible I/O while operating within a core supply range of 0.97–1.03 V and an ambient temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 39,600 logic elements enabling substantial programmable logic capacity for custom digital functions.
• Embedded Memory  Approximately 1.16 Mbits of on-chip RAM to support buffering, LUT-based storage, and state machines within the FPGA fabric.
• I/O Capacity  328 user I/O pins suitable for multi-channel interfacing, parallel buses, and control signals.
• Power and Supply  Defined core voltage supply range of 0.97 V to 1.03 V for consistent power provisioning in system designs.
• Package and Mounting  484-ball BGA (484-FBGA, 23×23) in a surface-mount package that supports compact board layouts and high-density integration.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C for standard commercial environments.
• Regulatory  RoHS compliant to meet common lead-free manufacturing requirements.
• Manufacturer  Intel Cyclone IV E family — documented in the Cyclone IV Device Handbook for device-level specifications and design guidance.

Typical Applications

• High-density logic implementations  Use the approximately 39,600 logic elements to implement custom state machines, protocol handlers, and combinational/sequential logic blocks.
• Memory-centric designs  Leverage roughly 1.16 Mbits of embedded RAM for buffering, FIFOs, and local data storage without external memory.
• Multi-interface systems  The 328 I/O pins enable consolidation of multiple peripheral interfaces and parallel data paths on a single FPGA device.

Unique Advantages

• Substantial on-chip logic density:  Approximately 39,600 logic elements allow consolidation of multiple digital functions into a single device, reducing BOM count.
• Significant embedded RAM:  Around 1.16 Mbits of internal memory supports local buffering and state storage, minimizing reliance on external memories.
• Wide I/O availability:  328 user I/Os provide flexibility for interfacing to sensors, controllers, and parallel buses without extensive multiplexing.
• Compact surface-mount packaging:  484-FBGA (23×23) enables high-density PCB integration for space-constrained designs.
• Commercial temperature suitability:  Rated 0 °C to 85 °C for deployment in standard commercial electronic products.
• RoHS compliance:  Supports lead-free manufacturing and regulatory requirements for many regions and product lines.

Why Choose EP4CE40F23C8LN?

The EP4CE40F23C8LN positions itself as a commercially graded, high-density Cyclone IV E FPGA option for designers needing a balance of logic capacity, on-chip memory, and extensive I/O in a compact BGA package. Its defined core supply range and documented device handbook support predictable integration into power and thermal budgets.

This device is well suited for engineering teams implementing consolidated digital functions, memory-backed data paths, or multi-interface platforms that benefit from reconfigurable logic and a proven device family from Intel.

If you would like pricing, availability, or to request a personalized quote for EP4CE40F23C8LN, submit an inquiry or request a formal quote through your procurement process today.