EP4CE40F23C8
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 1161216 39600 484-BGA |
|---|---|
| Quantity | 788 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 328 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2475 | Number of Logic Elements/Cells | 39600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1161216 |
Overview of EP4CE40F23C8 – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 I/Os · 1,161,216 bits · 39,600 logic elements · 484-BGA
The EP4CE40F23C8 is an Intel Cyclone® IV E field programmable gate array provided in a 484-ball BGA package. It delivers a mid-range programmable logic device with 39,600 logic elements, on-chip embedded memory and a broad set of I/O for system interfacing.
Designed for commercial-temperature applications, this device combines significant logic and memory resources with a 1.15–1.25 V core supply, making it suitable for a variety of embedded designs that require flexible, reprogrammable logic and a high I/O count.
Key Features
- Logic Capacity — Provides 39,600 logic elements to implement complex custom logic and state machines.
- Embedded Memory — Includes 1,161,216 bits of on-chip RAM (approximately 1.16 Mbits) for buffering, FIFOs, and small data storage structures.
- I/O Resources — Offers 328 user I/Os to support wide data buses, multiple interfaces, and flexible pin assignments.
- Power and Core Voltage — Operates from a core supply of 1.15 V to 1.25 V, consistent with Cyclone IV family operating conditions.
- Package and Mounting — Supplied in a 484-ball fine-pitch BGA (484-FBGA, 23×23) for surface-mount PCB designs requiring dense, compact packaging.
- Operating Range — Rated for commercial operation from 0°C to 85°C.
- RoHS Compliance — Device is RoHS compliant.
- Manufacturer Documentation — Device is documented in the Cyclone IV Device Handbook and includes manufacturer-specified operating and DC characteristics.
Unique Advantages
- Substantial Programmable Logic: 39,600 logic elements enable implementation of medium-complexity processing, glue logic, and custom peripherals without external ASICs or discrete logic.
- Integrated On-Chip Memory: Approximately 1.16 Mbits of embedded RAM reduces the need for external SRAM for many buffering and temporary storage tasks, simplifying board design.
- High I/O Count: 328 I/Os allow direct interfacing to multiple buses and peripherals, minimizing level-shifting or external I/O expanders.
- Compact BGA Package: The 484-FBGA (23×23) package supports high-density PCB layouts and reliable surface-mount assembly.
- Commercial Temperature and RoHS: Rated for 0°C to 85°C operation and RoHS compliant for use in standard commercial-product assemblies.
- Documented Manufacturer Support: Device specifications and operating conditions are published in the Cyclone IV Device Handbook with manufacturer warranty language covering performance to current specifications.
Why Choose EP4CE40F23C8?
The EP4CE40F23C8 positions itself as a flexible, mid-density Cyclone IV E FPGA suitable for developers who need substantial programmable logic, embedded memory, and a high I/O count in a compact surface-mount BGA. Its specified core voltage range and documented device handbook provide the electrical and operational detail engineers rely on for integration.
This part is appropriate for teams seeking a reprogrammable platform with around 39,600 logic elements and roughly 1.16 Mbits of on-chip RAM, delivered in a 484-ball FBGA package and rated for commercial-temperature deployments. The combination of resources and manufacturer documentation supports iterative development and long-term design stability.
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