EP4CE40F23C6
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 1161216 39600 484-BGA |
|---|---|
| Quantity | 219 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 328 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2475 | Number of Logic Elements/Cells | 39600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1161216 |
Overview of EP4CE40F23C6 – Cyclone® IV E FPGA, 39,600 logic elements, ~1.16 Mbits RAM, 328 I/Os, 484-BGA
The EP4CE40F23C6 is a Cyclone IV E field-programmable gate array (FPGA) device providing programmable logic resources for custom digital designs. The device combines 39,600 logic elements with approximately 1.16 Mbits of embedded RAM and 328 user I/Os in a 484-BGA package to support mid-density integration requirements.
Designed for commercial-temperature applications, this surface-mount FPGA targets use cases that require flexible hardware programmability, moderate on-chip memory, and a high I/O count in a compact BGA footprint.
Key Features
- Logic Capacity — 39,600 logic elements for implementing custom combinational and sequential logic functions.
- Embedded Memory — Approximately 1.16 Mbits of total on-chip RAM to support buffering, lookup tables, and other memory-backed logic.
- I/O Resources — 328 I/O pins to interface with external devices, peripherals, sensors, and buses.
- Power and Core Supply — Core voltage supply range from 1.15 V to 1.25 V to match system power domains and enable reliable core operation within specified limits.
- Package and Mounting — 484-ball FBGA package (23 × 23) in a surface-mount form factor for compact board-level integration.
- Operating Range and Grade — Commercial grade operation from 0 °C to 85 °C for standard embedded and electronic applications.
- Compliance — RoHS-compliant package and manufacturing status supporting environmental regulatory requirements.
- Documentation — Supported by Cyclone IV device handbook and device datasheet information for electrical, timing, and packaging specifications.
Typical Applications
- Custom Logic and Prototyping — Implement and iterate digital logic designs using the device’s 39,600 logic elements and embedded RAM for rapid development and validation.
- Embedded Control and Interfaces — Use the 328 I/Os to bridge sensors, control peripherals, and implement custom interface logic in compact systems.
- Data Buffering and Packet Processing — Leverage approximately 1.16 Mbits of on-chip RAM for buffering, FIFO implementations, and small-scale data processing tasks.
Unique Advantages
- Balanced Logic and Memory: The combination of 39,600 logic elements and ~1.16 Mbits of RAM provides a practical balance for mid-density designs without external memory in many cases.
- High I/O Count: 328 user I/Os simplify connectivity to multiple peripherals and external subsystems, reducing the need for additional interface components.
- Compact BGA Packaging: The 484-FBGA (23×23) package delivers a high pin count in a compact surface-mount footprint ideal for space-constrained PCBs.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C, the device is appropriate for a wide range of commercial embedded applications.
- Regulatory Compliance: RoHS compliance supports environmental requirements and simplifies product qualification for markets that require restricted-substance adherence.
Why Choose EP4CE40F23C6?
The EP4CE40F23C6 positions itself as a mid-density Cyclone IV E FPGA that blends substantial programmable logic capacity with meaningful on-chip RAM and a high I/O complement in a compact 484-BGA package. Its specified core voltage range and commercial operating temperature make it suitable for production applications requiring reliable programmable logic in standard environmental conditions.
This device is well suited for design teams and integrators who need flexible hardware programmability, moderate embedded memory, and broad I/O connectivity while maintaining a compact board footprint and RoHS compliance. Documentation and datasheet materials are available to support electrical, timing, and packaging integration decisions.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the EP4CE40F23C6. Sales and quoting teams can provide lead-time details and support for your design requirements.

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