EP4CE30F29I8LN

The EP4CE30F29I8LN is a Cyclone® IV field programmable gate array (FPGA) IC from Intel, provided in a 780-ball FBGA (29×29) package and rated for industrial-grade operation. It delivers a balance of programmable logic capacity, on-chip RAM, and a high I/O count for designs that require flexible digital integration within an industrial temperature range.

This device is suitable where reprogrammable logic, significant I/O integration, and reliable operation between −40 °C and 100 °C are required. Core supply requirements are specified between 0.97 V and 1.03 V.

Key Features

• Logic Capacity — 28,848 logic elements with 1,803 logic blocks, enabling implementation of complex custom digital functions.
• Embedded Memory — Approximately 0.608 Mbits of on-chip RAM for data buffering, small FIFOs, and state storage.
• I/O Integration — 532 user I/Os to support multiple interfaces and parallel signal routing from a single device.
• Package and Mounting — 780-FBGA (29×29) package, surface-mount mounting type for compact, high-density board designs.
• Power — Core supply voltage specified from 0.97 V to 1.03 V to match system power-rail requirements.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for demanding environments.
• Standards Compliance — RoHS compliant for regulatory and environmental compatibility.
• Documentation — Supported by Cyclone IV device handbook and related device datasheet material maintained by the vendor.

Typical Applications

• Industrial Control and Automation — Implement custom control logic, signal conditioning, and I/O aggregation using industrial temperature ratings and a high I/O count.
• Embedded Systems and Prototyping — Rapidly iterate custom peripherals and interfaces using the device’s programmable fabric and embedded memory capacity.
• I/O Expansion and Protocol Bridging — Consolidate multiple interfaces and protocol translators into a single device with 532 available I/Os in a compact BGA package.
• Communications and Data Handling — Use on-chip RAM and logic resources for buffering, packet handling, or custom data-path implementations.

Unique Advantages

• High Logic Density: 28,848 logic elements provide substantial capacity to implement complex digital functions without external ASICs or multiple discrete devices.
• Significant I/O Count: 532 user I/Os reduce the need for external I/O expanders and simplify board-level interface routing.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, supporting deployment in a wide range of industrial environments.
• Compact, High‑Density Packaging: 780-FBGA (29×29) enables a small PCB footprint while maintaining extensive I/O and logic capability.
• Low-Voltage Core: Narrow core supply range (0.97 V–1.03 V) aligns with modern power management designs for consistent core operation.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP4CE30F29I8LN?

The EP4CE30F29I8LN offers a practical combination of logic resources, embedded memory, and a high I/O count in a compact 780‑FBGA package, making it well suited to industrial-grade programmable logic tasks. Its documented operating conditions and vendor device handbook support reliable integration into designs that require sustained operation across a broad temperature range.

This device is appropriate for design teams seeking scalable, reprogrammable hardware capacity with strong I/O integration and industrial temperature capability, backed by the Cyclone IV device documentation from the vendor.

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