EP4CE30F29C9LN

IC FPGA 532 I/O 780FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 532 608256 28848 780-BGA

Quantity 547 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BGANumber of I/O532Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1803Number of Logic Elements/Cells28848
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of EP4CE30F29C9LN – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 532 608256 28848 780-BGA

The EP4CE30F29C9LN is a Cyclone IV E field programmable gate array (FPGA) from Intel, delivered in a 780-ball BGA package. It provides a balance of programmable logic, embedded memory, and a large number of I/O pins for commercial embedded designs.

With 28,848 logic elements, approximately 0.6 Mbits of on-chip RAM, and up to 532 I/Os, this device targets applications requiring mid-density logic integration, significant local memory resources, and extensive external interfacing while operating in standard commercial temperature ranges.

Key Features

  • Core Capacity — 28,848 logic elements for implementing combinational and sequential logic, enabling complex state machines and custom datapaths.
  • Embedded Memory — 608,256 total RAM bits (approximately 0.6 Mbits) to support buffering, lookup tables, and on-chip data storage.
  • High I/O Count — Up to 532 I/Os to connect sensors, peripherals, memory interfaces, or board-level buses without external multiplexing.
  • Supply Voltage — Core supply range specified at 0.970 V to 1.03 V for compatibility with system power rails and predictable core operation.
  • Package & Mounting — 780-ball FBGA (29 × 29) surface-mount package delivering high pin density in a compact footprint for board-level integration.
  • Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation, suitable for standard commercial electronics environments.
  • RoHS Compliant — Manufactured to meet RoHS requirements, supporting environmentally compliant product designs.

Typical Applications

  • Embedded Systems — Integrate custom logic, control algorithms, and local memory into single-board solutions using substantial logic and RAM resources.
  • High‑I/O Interfaces — Implement parallel or mixed-signal interface bridging where tens to hundreds of external connections are required.
  • Signal Processing & Acceleration — Offload deterministic datapath tasks and buffering to on-chip logic and memory for latency-sensitive processing.
  • Prototyping and Evaluation — Validate system architectures that require mid-density programmable logic and extensive I/O before scaling to production.

Unique Advantages

  • Generous Logic Capacity: 28,848 logic elements allow implementation of sizeable custom logic blocks without external ASICs.
  • Significant On-Chip Memory: Approximately 0.6 Mbits of embedded RAM reduces dependence on external memory for buffering and LUT-based functions.
  • Extensive I/O Availability: Up to 532 I/Os simplify board-level integration and reduce the need for external multiplexers or IO expanders.
  • Compact High-Density Package: 780-BGA (29 × 29) provides a high pin count in a compact footprint, enabling dense PCB routing for complex designs.
  • Commercial Temperature Suitability: Rated 0 °C to 85 °C for reliable operation in typical commercial environments and consumer applications.
  • Regulatory Compliance: RoHS compliance supports environmentally responsible product development and supply chain requirements.

Why Choose EP4CE30F29C9LN?

The EP4CE30F29C9LN Cyclone IV E FPGA combines a mid-density logic fabric with substantial embedded RAM and a broad complement of I/O in a compact 780-BGA package, positioning it for commercial designs that need programmable integration without excessive board-level complexity. Its specified core voltage window and commercial operating range offer predictable electrical and thermal behavior for standard embedded applications.

This device is appropriate for engineering teams building solutions that require on-chip memory, flexible I/O connectivity, and the ability to implement complex custom logic while leveraging manufacturer documentation and device handbook guidance for design and validation.

Request a quote or submit an inquiry to obtain pricing and availability for the EP4CE30F29C9LN. Our team can assist with lead time and ordering information to support your project schedules.

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