EP4CE30F29I7

The EP4CE30F29I7 is a Cyclone® IV E family FPGA from Intel designed for embedded and industrial applications requiring substantial logic capacity and a high I/O count. It provides 28,848 logic elements across 1,803 CLBs and approximately 0.608 Mbits of on-chip RAM to support complex, programmable digital designs.

Packaged in a 780-ball FBGA (29×29) surface-mount package and specified for operation from -40 °C to 100 °C, this device targets systems that need dense programmable logic, extensive I/O connectivity, and predictable supply requirements with a 1.15 V core supply.

Key Features

• Core Logic: 28,848 logic elements implemented across 1,803 CLBs, enabling substantial programmable logic capacity for mid-range FPGA designs.
• Embedded Memory: Approximately 0.608 Mbits of on-chip RAM for local data buffering, FIFOs, and state storage without external memory in many use cases.
• I/O Density: 532 available I/O pins to support wide parallel interfaces, bus connections, and multiple peripheral links directly from the FPGA.
• Package & Mounting: 780-ball FBGA (29×29) in a surface-mount tray package, allowing compact board-level integration and high-pin-count routing.
• Power: Fixed core voltage requirement of 1.15 V, simplifying power-supply planning and enabling consistent core operation.
• Industrial Temperature Range: Specified for operation from -40 °C to 100 °C to meet environmental requirements for industrial deployments.

Typical Applications

• Industrial Control & Automation: Implement motor control logic, programmable sequencing, and I/O aggregation where wide connectivity and industrial temperature operation are required.
• Embedded Systems & Prototyping: Use the device for embedded logic acceleration, custom peripherals, and proof-of-concept designs leveraging its logic capacity and on-chip RAM.
• High-Density I/O Interfaces: Drive parallel sensors, data buses, or multi-channel digital I/O where a large number of pins (532) simplifies board-level interfacing.

Unique Advantages

• Significant Logic Density: 28,848 logic elements support complex finite-state machines, datapaths, and control logic without excessive external components.
• On-Chip Memory: Approximately 0.608 Mbits of embedded RAM reduces the dependence on external memory for buffering and small data storage needs.
• High I/O Count: 532 I/Os enable multi-interface designs and reduce the need for external multiplexers or expanders.
• Industrial Temperature Rating: Operation from -40 °C to 100 °C allows deployment in environments with wide temperature swings.
• Compact High-Pin Package: 780-FBGA (29×29) delivers a high pin count in a compact footprint for space-constrained PCBs.
• Predictable Power Requirement: A defined 1.15 V supply simplifies power design and ensures consistent core operation across designs.

Why Choose EP4CE30F29I7?

The EP4CE30F29I7 delivers a balanced combination of logic capacity, embedded memory, and high I/O density in a compact 780-FBGA package from Intel. Its industrial temperature rating and fixed core supply make it suitable for engineered systems where predictable behavior and robust operation are important.

This FPGA is appropriate for engineers and procurement teams designing mid-range programmable solutions that require substantial on-chip resources, broad connectivity, and board-level compactness while leveraging Intel’s Cyclone IV E family heritage and documentation.

Request a quote or submit an inquiry for pricing and availability to evaluate the EP4CE30F29I7 for your next project.