EP4CE30F29I8L

The EP4CE30F29I8L is an Intel Cyclone® IV field‑programmable gate array (FPGA) supplied in a 780‑FBGA (29×29) package. It delivers a balance of programmable logic capacity, on‑chip memory, and a high I/O count intended for industrial applications that require reconfigurable logic and robust operating temperature performance.

Key Features

• Logic Capacity — 28,848 logic elements provide substantial programmable logic resources for implementing custom digital designs.
• Embedded Memory — 608,256 bits of on‑chip RAM, approximately 0.61 Mbits of embedded memory for data buffering and state storage.
• I/O Resources — 532 user I/O pins to support dense external connectivity and interface integration.
• Industrial Grade & Temperature Range — Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Supply Specification — Voltage supply specified at 970 mV.
• Package & Mounting — 780‑FBGA (29×29) supplier package; surface‑mount device supplied in tray format for PCB assembly.

Typical Applications

• Industrial control and automation — Suitable for programmable logic functions in industrial systems where the industrial temperature rating and high I/O count are required.
• Embedded systems — Provides on‑chip memory and logic resources for custom digital processing and interface aggregation in embedded designs.
• Prototyping and development — Reconfigurable logic capacity and broad I/O allow rapid iteration of hardware functions during development phases.

Unique Advantages

• High logic density: 28,848 logic elements enable complex digital functions without discrete ASIC development.
• Significant on‑chip RAM: Approximately 0.61 Mbits of embedded memory for local buffering, FIFOs, and state machines.
• Extensive I/O connectivity: 532 I/O pins accommodate multiple interfaces and peripheral connections, reducing the need for external I/O expanders.
• Designed for industrial environments: Industrial grade construction and −40 °C to 100 °C operating range support deployment in harsher temperature conditions.
• Compact BGA package: 780‑FBGA (29×29) offers a space‑efficient footprint suitable for high‑density board designs.

Why Choose EP4CE30F29I8L?

The EP4CE30F29I8L positions itself as a flexible, industrial‑grade Cyclone® IV FPGA option that combines a large pool of logic elements, embedded RAM, and a high number of I/Os in a compact 780‑FBGA package. These characteristics make it suitable for engineers seeking a reconfigurable platform for industrial and embedded applications that demand solid thermal performance and sizable programmable resources.

Backed by Intel’s Cyclone IV device family documentation, this device is appropriate for designs that require scalability, reprogrammability, and the ability to integrate multiple digital functions onto a single IC, helping reduce system BOM and accelerate time to market.

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