EP4CE40F23A7N

The EP4CE40F23A7N is a Cyclone® IV E field programmable gate array (FPGA) from Intel, offering reconfigurable logic in a 484‑ball FBGA (23×23) package. It delivers 39,600 logic elements and approximately 1.16 Mbits of embedded memory, with up to 328 user I/Os, making it suitable for designs that require moderate logic density and high I/O count.

With a core supply range of 1.15 V to 1.25 V, surface‑mount packaging, RoHS compliance, and AEC‑Q100 qualification, this device is positioned for applications that demand reliable operation across a broad temperature range from −40 °C to 125 °C.

Key Features

• Core Logic  Provides 39,600 logic elements to implement custom digital functions, finite state machines, and glue logic.
• Embedded Memory  Approximately 1.16 Mbits of on‑chip RAM to store buffers, small lookup tables, and intermediate data.
• I/O Capacity  Up to 328 user I/Os to support dense peripheral connectivity and board‑level interfacing.
• Package and Mounting  484‑FBGA (23×23) ball grid array in a surface‑mount format for compact, high‑density PCB layouts.
• Power  Core voltage supply range of 1.15 V to 1.25 V to match system power architectures for the Cyclone IV E family.
• Temperature and Qualification  Qualified to AEC‑Q100 and rated for operation from −40 °C to 125 °C, supporting automotive application requirements.
• Environmental Compliance  RoHS‑compliant for lead‑free manufacturing and regulatory alignment.

Typical Applications

• Automotive systems  AEC‑Q100 qualification and wide operating temperature make the device suitable for in‑vehicle and automotive electronic designs that require reconfigurable logic and robust temperature performance.
• Embedded hardware platforms  Combines moderate logic density and on‑chip RAM to implement custom control, protocol bridging, and interface logic in embedded systems.
• High‑I/O designs  Large I/O count supports applications with multiple peripherals, sensors, or external interfaces requiring dense connectivity.

Unique Advantages

• Balanced logic and memory capacity: 39,600 logic elements paired with approximately 1.16 Mbits of embedded memory supports a wide range of mid‑density designs without external memory dependence.
• High I/O density: 328 user I/Os enable flexible system interfacing and reduce the need for additional I/O expanders.
• Automotive qualification: AEC‑Q100 qualification and a −40 °C to 125 °C rating provide traceable suitability for automotive electronics projects.
• Compact, board‑level form factor: 484‑FBGA (23×23) surface‑mount package optimizes PCB area for space‑constrained designs.
• Regulatory readiness: RoHS compliance facilitates use in lead‑free manufacturing environments.

Why Choose EP4CE40F23A7N?

The EP4CE40F23A7N delivers a practical combination of logic capacity, embedded memory, and high I/O count in a compact 484‑FBGA package. Its AEC‑Q100 qualification and wide operating temperature range make it a suitable candidate for designs that require both reconfigurable logic and robust environmental performance.

Choose this Cyclone® IV E FPGA when you need a scalable, board‑level programmable device that balances integration, I/O capability, and automotive‑grade qualification to support long‑term system reliability and flexible design updates.

If you would like pricing, lead‑time information or to submit a quote request for the EP4CE40F23A7N, please request a quote or submit an inquiry to our sales team.