EP4CE40F23C7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 1161216 39600 484-BGA |
|---|---|
| Quantity | 1,605 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 328 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2475 | Number of Logic Elements/Cells | 39600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1161216 |
Overview of EP4CE40F23C7N – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 1161216 39600 484-BGA
The EP4CE40F23C7N is an Intel Cyclone IV E field programmable gate array (FPGA) supplied in a 484-ball BGA package. It provides a mid-range FPGA architecture with 39,600 logic elements, approximately 1.16 Mbits of embedded RAM, and 328 I/O to support complex logic and interfacing requirements in commercial designs.
Designed for surface-mount assembly and RoHS compliance, this device operates from a 1.15 V to 1.25 V core supply and is specified for commercial temperature operation from 0 °C to 85 °C.
Key Features
- Core Logic 39,600 logic elements for implementing medium-density programmable logic and custom processing pipelines.
- On‑chip Memory Approximately 1.16 Mbits of embedded RAM to store state, buffers, and lookup tables close to logic for low-latency data handling.
- I/O Capacity 328 I/Os to support extensive interfacing, multiple peripherals, and board-level connectivity.
- Power and Supply Core supply range of 1.15 V to 1.25 V to match targeted power domains and support predictable power budgeting.
- Package and Mounting 484-BGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for compact board integration and high pin density.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for standard commercial environments.
- Regulatory Compliance RoHS-compliant material composition to meet common environmental and manufacturing requirements.
Typical Applications
- High-density I/O systems Boards requiring up to 328 I/Os for sensor arrays, peripheral aggregation, or protocol bridging where abundant IO connectivity is necessary.
- Mid-range programmable logic Implementing custom control logic, protocol conversion, or moderate-scale data-path processing using 39,600 logic elements and on-chip RAM.
- Embedded system acceleration Offloading deterministic tasks and buffering data locally with approximately 1.16 Mbits of embedded memory to reduce external memory traffic.
Unique Advantages
- Balanced logic and memory capacity: 39,600 logic elements paired with ~1.16 Mbits of RAM enables a mix of control logic and data buffering without immediate reliance on external memory.
- Generous I/O count: 328 I/Os support complex board-level connectivity and flexible interface mapping to peripherals and external devices.
- Compact, high‑pin package: 484-FBGA (23×23) provides a dense pinout in a small footprint suitable for space-constrained PCBs.
- Vendor pedigree: Part of the Cyclone IV family with documented device handbook and device-level specifications to support engineering validation and design integration.
- Commercial-grade suitability: Specified for 0 °C to 85 °C to match standard commercial product deployment profiles.
- RoHS-compliant: Meets common environmental handling and manufacturing requirements for modern electronics production.
Why Choose EP4CE40F23C7N?
The EP4CE40F23C7N delivers a practical combination of logic density, embedded RAM, and I/O capacity for commercial embedded designs that require medium-scale programmability and extensive board interfacing. Its 484-BGA package and surface-mount mounting make it suitable for compact PCBs where pin density and integration matter.
This device is appropriate for engineering teams seeking a Cyclone IV E FPGA with verifiable electrical and thermal operating points (1.15–1.25 V core, 0 °C–85 °C) and RoHS compliance, backed by the Cyclone IV device handbook and manufacturer documentation.
Request a quote or submit a procurement inquiry to get pricing and availability for the EP4CE40F23C7N.

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