EP4CE40F23C9L

The EP4CE40F23C9L is a Cyclone® IV E field programmable gate array (FPGA) manufactured by Intel, offered in a 484-ball BGA package. The device delivers a combination of logic density, on-chip memory and a high I/O count suitable for compact, surface-mount designs.

Key on-chip resources include 39,600 logic elements and approximately 1.16 Mbits of embedded memory, with 328 available I/O pins and a supply voltage range of 0.97 V to 1.03 V. The device is specified for commercial-grade operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

• Core Architecture — Cyclone IV E FPGA family device providing a programmable logic fabric with 39,600 logic elements for implementing custom digital functions.
• Logic Density — 39,600 logic elements to support medium-to-high complexity designs within a single device footprint.
• Embedded Memory — 1,161,216 total RAM bits (approximately 1.16 Mbits) for on-chip buffering, LUT-based storage or small data tables.
• I/O Capacity — 328 user I/O pins to support multiple parallel interfaces, bus bridges and board-level signal connectivity.
• Power and Voltage — Core supply range specified at 0.97 V to 1.03 V to match system power rails and power budgeting requirements.
• Package & Mounting — 484-ball FBGA package (23 × 23 ball array) optimized for surface-mount assembly and compact PCB integration.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial deployments.
• Compliance — RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Custom digital logic and prototyping — Use the 39,600 logic elements to implement bespoke digital functions, state machines and hardware accelerators in development and production designs.
• High-density I/O interfacing — The 328 I/O pins support parallel interfaces, board-level signal routing and multi-channel connectivity in compact packages.
• On-chip buffering and storage — Approximately 1.16 Mbits of embedded memory available for FIFO buffering, small data caches and temporary storage close to logic.
• Compact, surface-mount systems — The 484-FBGA (23 × 23) package enables dense PCB layouts where board space and reliable surface-mount assembly are required.

Unique Advantages

• Significant logic capacity: 39,600 logic elements provide headroom for implementing complex logic blocks without external glue logic.
• Substantial on-chip memory: Approximately 1.16 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 328 I/O pins enable versatile interfacing options for multi-channel and parallel designs.
• Compact package footprint: 484-FBGA (23 × 23) supports surface-mount assembly in space-constrained systems while maintaining signal routing density.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation to match standard commercial deployments and environments.
• Regulatory alignment: RoHS compliance supports green manufacturing and regulatory needs.

Why Choose EP4CE40F23C9L?

The EP4CE40F23C9L balances logic density, embedded memory and I/O capacity in a compact 484-BGA surface-mount package, making it well suited for designers who need substantial programmable resources in a space-efficient form factor. Its defined supply voltage range and commercial temperature rating provide clear system-level constraints for reliable integration into standard embedded and electronic designs.

This device is appropriate for engineering teams and procurement looking for a Cyclone IV E family FPGA with a clear specification set—logic capacity, on-chip RAM, I/O count, package type and RoHS status—backed by vendor documentation and device handbook references.

Request a quote or submit an inquiry to receive pricing and availability information for EP4CE40F23C9L and support materials to help integrate this FPGA into your next design.