EP4CE40F23I8L

The EP4CE40F23I8L is a Cyclone IV E field-programmable gate array (FPGA) offering a balance of programmable logic density, embedded memory, and high I/O count in a compact 484-BGA package. Designed for surface-mount PCB integration, this device targets industrial applications that require reliable operation across a wide temperature range.

With 39,600 logic elements and approximately 1.16 Mbits of on-chip RAM, the device supports complex digital logic, glue-less system integration, and control functions while operating from a low core voltage range of 0.97–1.03 V.

Key Features

• Logic Capacity — 39,600 logic elements to implement medium-to-complex FPGA designs and custom logic functions.
• Embedded Memory — Approximately 1.16 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage.
• I/O and Connectivity — 328 user I/Os to support wide peripheral interfacing and multi-channel signal routing.
• Package and Mounting — 484-FBGA (23×23) package case in a surface-mount form factor for high-density board layouts.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial-temperature environments.
• Core Voltage — Supported core supply range of 0.97 V to 1.03 V for low-voltage system designs.
• Compliance — RoHS-compliant construction for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control — Implement motor drives, PLC interfaces, and machine-control logic using the device's logic density and extended temperature rating.
• Embedded Systems — Integrate glue logic, protocol adapters, and custom peripheral controllers leveraging the large I/O count and on-chip RAM.
• Communications and Networking — Support packet buffering, protocol bridging, and interface logic where moderate logic resources and plentiful I/Os are required.

Unique Advantages

• High Logic Density: 39,600 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial On-Chip Memory: Approximately 1.16 Mbits of embedded RAM supports data buffering and temporary storage without external memory.
• Extensive I/O Count: 328 I/Os allow broad peripheral connectivity and flexible system partitioning.
• Industrial Qualification: Operation from −40 °C to 100 °C and industrial grade designation support deployment in demanding environments.
• Compact BGA Package: 484-FBGA (23×23) provides a space-efficient footprint for high-density designs while remaining surface-mount compatible.
• RoHS Compliant: Meets environmental compliance expectations for modern manufacturing and assembly processes.

Why Choose EP4CE40F23I8L?

The EP4CE40F23I8L positions itself as a practical choice for engineers seeking a balance of programmable logic, embedded memory, and extensive I/O in an industrial-temperature FPGA. Its combination of 39,600 logic elements, approximately 1.16 Mbits of on-chip RAM, and 328 I/Os helps simplify system architectures by enabling integration of control, interfacing, and buffering functions on a single device.

This part is well suited for teams building industrial control, embedded processing, or communications interfaces that require predictable voltage operation, a compact 484-FBGA package, and RoHS-compliant manufacturing. The device provides a scalable platform for designs that prioritize integration, board-area efficiency, and wide-temperature reliability.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for the EP4CE40F23I8L. Our team can provide technical details and support to help specify this FPGA in your next design.