EP4S40G5H40I3

IC FPGA 654 I/O 1517HBGA
Part Description

STRATIX® IV GT Field Programmable Gate Array (FPGA) IC 654 28033024 531200 1517-BBGA, FCBGA

Quantity 413 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeIndustrialOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O654Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4S40G5H40I3 – STRATIX® IV GT FPGA, 531,200 logic elements, 654 I/Os

The EP4S40G5H40I3 is a Stratix IV GT field programmable gate array (FPGA) in a high-density FCBGA package designed for applications that require large logic capacity and extensive I/O. It leverages the Stratix IV GT device family architecture and on-chip resources described in the Stratix IV Device Handbook.

With 531,200 logic elements and approximately 28 Mbits of embedded memory, this industrial-grade, surface-mount FPGA is suited to designs that need high integration, abundant I/O, and support for high-speed transceiver-based interfaces. The device operates over a 0 °C to 100 °C range and a core supply between 920 mV and 980 mV.

Key Features

  • Core Logic: 531,200 logic elements provide substantial fabric for implementing complex custom logic, control paths, and hardware acceleration.
  • Embedded Memory: Approximately 28 Mbits of on-chip RAM to support large buffering, FIFOs, and memory-intensive algorithms.
  • I/O Density: 654 general-purpose I/Os to interface with multiple peripherals, memory devices, and high-pin-count systems.
  • High-Speed Transceiver Architecture: Stratix IV GT device family features high-speed transceivers and protocol support as described in the device handbook, enabling implementation of serial links and protocol interfaces.
  • Clocking and DSP Support: Family-level features include robust clock networks, PLLs, and DSP block support referenced in the Stratix IV documentation for timing and signal processing tasks.
  • Package and Mounting: 1517-BBGA FCBGA package (supplier package 1517-HBGA, 42.5 × 42.5 mm) in a surface-mount form factor for compact board-level integration.
  • Power: Core voltage supply range of 920 mV to 980 mV for core power planning and regulator selection.
  • Industrial Grade and Temperature Range: Rated for 0 °C to 100 °C operation to meet industrial environment requirements.
  • Regulatory Compliance: RoHS-compliant manufacturing status.

Typical Applications

  • High-speed serial interfaces: Implement protocol endpoints and serial link handling using the Stratix IV GT transceiver architecture documented in the device handbook.
  • External memory interfaces: Use the device’s logic density and embedded memory to build controllers and interfaces for external DRAM and high-bandwidth memory subsystems.
  • DSP and signal processing: Leverage on-chip memory and the family’s DSP resources for high-throughput signal conditioning, filtering, and real-time processing.
  • System integration and diagnostics: Consolidate multiple functions and diagnostic features into a single FPGA to simplify system design and testing.

Unique Advantages

  • Highly integrated logic and memory: 531,200 logic elements and approximately 28 Mbits of embedded RAM enable compact implementations that reduce external components.
  • Extensive I/O availability: 654 I/Os provide flexibility to connect a wide variety of peripherals, memory devices, and interface standards without extra buffers.
  • Designed for high-speed serial workloads: The Stratix IV GT device family includes transceiver and protocol support documented in the device handbook, enabling serial link implementations.
  • Industrial operating range: 0 °C to 100 °C rating supports deployment in a range of industrial environments.
  • Compact FCBGA package: 1517-BBGA (1517-HBGA supplier package, 42.5 × 42.5 mm) provides high pin density in a board-friendly surface-mount footprint.
  • Compliance and sourcing readiness: RoHS-compliant status supports regulatory requirements for many production environments.

Why Choose EP4S40G5H40I3?

The EP4S40G5H40I3 positions itself as a high-capacity Stratix IV GT FPGA option for designs that require significant logic resources, substantial on-chip memory, and broad I/O count within an industrial temperature envelope. Its specification set supports implementations that consolidate functions, reduce external components, and address high-speed serial and memory-interface requirements.

Designers can rely on the Stratix IV device family documentation and device handbook for detailed architectural and transceiver guidance while leveraging the EP4S40G5H40I3’s combination of logic density, embedded memory, and package choices for scalable, production-ready solutions.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for EP4S40G5H40I3.

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