EP4SE230F29C2

IC FPGA 488 I/O 780FBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 17544192 228000 780-BBGA, FCBGA

Quantity 1,112 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9120Number of Logic Elements/Cells228000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17544192

Overview of EP4SE230F29C2 – STRATIX IV E FPGA, 228,000 logic elements, 780‑FBGA (29×29)

The EP4SE230F29C2 is a STRATIX® IV E field‑programmable gate array (FPGA) manufactured by Intel. It is a member of the Stratix IV E device family and targets designs that require high on‑chip logic capacity, substantial embedded RAM, and large I/O counts.

Built on the Stratix IV E architecture described in the device handbook, this device combines a large logic fabric with the family’s architecture features—including DSP resources, PLLs, clock networks and high‑speed transceiver support—making it suitable for complex programmable logic and interface integration within commercial temperature ranges.

Key Features

  • Core Logic  Provides 228,000 logic elements for large-scale, custom logic implementation and parallel processing.
  • Embedded Memory  Approximately 17.54 Mbits of embedded memory (17,544,192 bits total) to support on‑chip buffering, FIFOs and local data storage.
  • I/O Density  488 I/O pins to support multiple external interfaces and high channel counts.
  • Stratix IV E Architecture  Device handbook references for the family include DSP blocks, PLLs, extensive clocking resources and high‑speed transceiver capabilities for protocol support and high aggregate bandwidth.
  • Power and Core Voltage  Core supply range specified at 870 mV to 930 mV for the FPGA core power domain.
  • Package and Mounting  780‑ball FBGA (29×29) package in a 780‑BBGA / FCBGA case, designed for surface‑mount PCB assembly.
  • Commercial Grade and Temperature  Commercial operating temperature range from 0 °C to 85 °C; classification listed as Commercial grade.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High‑performance signal processing  Leverage the device’s large logic capacity and the Stratix IV E architecture’s DSP resources for compute‑intensive algorithms and real‑time processing.
  • Multi‑interface bridging  Use the 488 I/Os to consolidate and manage multiple external interfaces, enabling protocol conversion and aggregation on a single device.
  • On‑chip buffering and memory‑centric logic  Embedded memory (17,544,192 bits) supports local buffering, packet queues and small memory‑mapped storage without immediate need for external RAM.

Unique Advantages

  • Large logic capacity: 228,000 logic elements allow implementation of wide datapaths, multiple hardware accelerators, and complex state machines on a single FPGA.
  • Significant on‑chip memory: Approximately 17.54 Mbits of embedded RAM reduces dependency on external memory for many control and buffering tasks.
  • High I/O count: 488 I/Os provide flexibility to attach many peripherals, sensors, or parallel interfaces without immediate external multiplexing.
  • Family architecture benefits: As a Stratix IV E device, it aligns with device handbook capabilities such as DSP blocks, PLLs and high‑speed transceiver support for designs that require advanced timing and signal processing features.
  • Compact, high‑pin package: The 780‑FBGA (29×29) surface‑mount package balances high pin count with a compact footprint for dense board designs.
  • Regulatory and commercial readiness: RoHS compliance and a defined commercial temperature range (0 °C to 85 °C) support standard commercial electronic product deployments.

Why Choose EP4SE230F29C2?

The EP4SE230F29C2 positions itself as a high‑capacity, commercially rated Stratix IV E FPGA that combines extensive logic resources, a substantial pool of on‑chip memory, and a high‑density I/O complement. These characteristics make it suitable for complex, interface‑rich designs where consolidating logic, memory and I/O into a single programmable device reduces board complexity.

Manufactured by Intel and documented in the Stratix IV device handbook, the EP4SE230F29C2 offers a clear specification set—logic elements, embedded RAM, I/O count, package type, core voltage range and operating temperature—allowing engineering and procurement teams to assess fit for mid‑to‑high complexity commercial FPGA applications with predictable supply and environmental classification.

Request a quote or submit a procurement inquiry for EP4SE230F29C2 to receive pricing and availability information.

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