EP4SE230F29C3
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 17544192 228000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,094 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9120 | Number of Logic Elements/Cells | 228000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 17544192 |
Overview of EP4SE230F29C3 – STRATIX® IV E FPGA, 228,000 logic elements, approximately 17.5 Mbits RAM, 488 I/O, 780‑BBGA
The EP4SE230F29C3 is a STRATIX IV E field-programmable gate array (FPGA) supplied in a 780‑BBGA FCBGA package. It delivers a high logic capacity and substantial on-chip memory in a compact surface-mount form factor suitable for commercial-grade designs.
With 228,000 logic elements and approximately 17.5 Mbits of embedded memory, this device is intended for designs that require dense programmable logic, significant embedded RAM, and a large number of I/O connections while operating within a 0 °C to 85 °C commercial temperature range.
Key Features
- Logic Capacity — 228,000 logic elements provide large-scale programmable logic resources for complex digital designs.
- Embedded Memory — Approximately 17.5 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage.
- I/O Resources — 488 user I/O pins for flexible connectivity and interface integration.
- Power Supply — Core voltage supply range from 870 mV to 930 mV, enabling proper integration with system power domains.
- Package & Mounting — 780‑BBGA (FCBGA) package, supplier device package 780‑FBGA (29×29), designed for surface-mount assembly to support dense board layouts.
- Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Standards Compliance — RoHS‑compliant, supporting regulatory requirements for lead‑free assemblies.
- Stratix IV Family Documentation — The Stratix IV device handbook and datasheet volumes include detailed specifications for electrical characteristics, DC and switching behavior, PLLs, DSP block specifications, TriMatrix memory blocks, transceiver performance, and configuration/JTAG functionality.
Typical Applications
- High‑performance digital processing — Large logic capacity and embedded memory enable implementation of compute‑intensive data-paths and custom accelerators.
- Network and communications — Extensive I/O and on‑chip resources support protocol processing and packet buffering in communication equipment.
- System integration and prototyping — Dense programmable logic and memory facilitate rapid development and consolidation of multiple functions onto a single device.
- Signal processing — Substantial logic and memory resources allow implementation of complex DSP chains and data buffering for real‑time processing tasks.
Unique Advantages
- High logic density: 228,000 logic elements reduce the need for multi‑device designs by consolidating large logic functions into a single FPGA.
- Significant embedded memory: Approximately 17.5 Mbits of on‑chip RAM supports large buffers and state storage without external memory.
- Extensive I/O: 488 I/O pins provide flexibility for interfacing with multiple peripherals and high‑pin‑count systems.
- Compact, board‑friendly package: 780‑BBGA (29×29) surface‑mount package supports high‑density PCB routing in space‑constrained designs.
- Commercial temperature suitability: Rated for 0 °C to 85 °C, appropriate for general commercial and industrial ambient conditions.
- Regulatory compliance: RoHS‑compliant construction aids in meeting environmental and assembly requirements.
Why Choose EP4SE230F29C3?
The EP4SE230F29C3 positions itself as a high‑capacity Stratix IV E FPGA option for designers who need substantial programmable logic and embedded memory in a single, surface‑mount package. Its combination of 228,000 logic elements, approximately 17.5 Mbits of on‑chip RAM, and 488 I/O pins makes it well suited to consolidate complex functions and reduce system BOM in demanding commercial applications.
Backed by the Stratix IV device handbook and detailed datasheet content covering electrical characteristics, PLLs, DSP blocks, memory blocks, and transceiver specifications, this device supports engineering workflows that require verifiable specifications and thorough technical documentation.
If you would like pricing, availability, or to request a formal quote for EP4SE230F29C3, submit a request and our team will respond with the next steps to procure this device.

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