EP4SE230F29C4

The EP4SE230F29C4 is a STRATIX® IV E field programmable gate array (FPGA) offered by Intel. It delivers high logic density and substantial embedded memory in a compact FCBGA package for programmable digital system integration.

With 228,000 logic elements, approximately 17.5 Mbits of on-chip RAM and 488 user I/O, this device is suited to complex digital designs that require large logic capacity, significant buffer memory and broad external interfacing while operating within commercial temperature limits.

Key Features

• Core Capacity 228,000 logic elements provide the programmable fabric needed for large-scale combinational and sequential logic implementations.
• Embedded Memory Approximately 17.5 Mbits of on-chip RAM (17,544,192 bits) for data buffering, FIFOs and memory-intensive datapaths.
• I/O and Interfaces 488 user I/O pins to support multiple external interfaces and parallel/serial connectivity requirements.
• Package and Mounting 780‑FBGA (29×29) FCBGA package in a surface-mount form factor for dense PCB integration.
• Power Device operates from a specified voltage supply range of 870 mV to 930 mV.
• Operating Range and Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Configuration and Test Support Configuration and JTAG specifications are provided as part of the Stratix IV device documentation for device programming and boundary-scan.
• Regulatory Compliance RoHS status: Compliant.

Typical Applications

• High-density digital systems — Use the large logic fabric to implement complex custom processors, glue logic, or state machines in advanced electronic systems.
• Memory-intensive datapaths — Approximately 17.5 Mbits of embedded RAM supports large buffers, FIFOs and local data storage for streaming or packet-based designs.
• I/O-rich interfaces — 488 user I/O pins enable connection to multiple peripherals, parallel buses and external transceiver subsystems.
• Compact, high-integration PCBs — The 780‑FBGA (29×29) surface-mount package helps maintain a small board footprint while delivering high integration.

Unique Advantages

• High logic density: 228,000 logic elements allow implementation of large, complex logic functions without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 17.5 Mbits of embedded RAM reduces external memory needs and improves bandwidth and latency for data-paths.
• Extensive external connectivity: 488 user I/O pins provide flexibility to interface with a wide range of peripherals and systems.
• Compact FCBGA packaging: The 780‑FBGA (29×29) package supports high-density board designs and surface-mount assembly.
• Controlled power envelope: Defined supply range of 870 mV–930 mV supports predictable power planning for system design.
• Documented configuration and test support: Configuration and JTAG specifications are provided in the Stratix IV device documentation to aid programming and production test.

Why Choose EP4SE230F29C4?

The EP4SE230F29C4 positions itself as a high-density STRATIX® IV E FPGA that combines a large logic fabric, significant embedded memory and extensive I/O in a compact 780‑FBGA package. Its commercial-grade operating range and defined supply requirements make it suitable for complex digital system designs that need on-chip memory and broad interfacing in a single programmable device.

Designers targeting scalable, memory- and I/O-heavy applications will find this device appropriate for consolidating functions, reducing external component count and leveraging the detailed device specifications provided in the Stratix IV device documentation.

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