EP4SE230F29I3G

The EP4SE230F29I3G is an Intel FPGA from the Stratix IV device family, delivering high-density programmable logic and on-chip memory for demanding digital designs. It combines a large logic fabric with embedded memory, DSP capabilities and high-speed I/O to address communications, signal processing and industrial applications that require configurable hardware acceleration.

Key Features

• Logic Capacity — 228,000 logic elements to implement complex custom logic, protocol engines and hardware accelerators.
• Embedded Memory — Approximately 17.5 Mbits of on-chip RAM for buffering, FIFOs and local data storage, reducing external memory dependency.
• I/O Density — 488 general-purpose I/O pins to support wide parallel interfaces and multiple high-speed links.
• Stratix IV Architecture — Device handbook references indicate architecture features such as FPGA fabric, DSP blocks, PLLs and high-speed transceiver support suitable for high-bandwidth designs.
• Power Supply Range — Core supply range of 870 mV to 930 mV to match system power-rail design requirements.
• Industrial Temperature Rating — Operating range from -40 °C to 100 °C for deployment in industrial environments.
• Package and Mounting — 780-ball FBGA package (780-FBGA, 29 × 29) and surface-mount mounting for compact, board-level integration.
• Regulatory Compliance — RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• Network and Communications Equipment — Implement protocol offloads, packet processing and interface bridging using the high logic count and abundant I/O.
• High‑Performance Signal Processing — Deploy DSP and custom processing pipelines enabled by the Stratix IV architecture and substantial embedded memory.
• Industrial Control and Automation — Use the industrial-grade temperature range and flexible I/O to manage motor control, sensor aggregation and machine‑level processing.
• Test & Measurement Systems — Leverage deterministic hardware processing and on-chip RAM for real‑time data capture and analysis.

Unique Advantages

• High Logic Density: 228,000 logic elements provide the headroom to implement multi-function systems and hardware-accelerated algorithms on a single device.
• Substantial On‑Chip Memory: Approximately 17.5 Mbits of embedded RAM reduces the need for external memory and simplifies board design for data-intensive applications.
• Broad I/O Count: 488 I/Os give designers flexibility to connect multiple peripherals, parallel buses and high-speed interfaces without multiplexing compromises.
• Industrial Robustness: Rated for -40 °C to 100 °C operation to meet the thermal demands of industrial deployments and harsh environments.
• Compact High‑Pin Package: 780-FBGA (29 × 29) balances a high pin count with a compact footprint for space-constrained PCBs.
• Standards‑oriented Architecture: Documentation for the Stratix IV family highlights support for high-speed transceivers, DSP blocks and clocking resources that streamline system integration.

Why Choose EP4SE230F29I3G?

The EP4SE230F29I3G positions itself as a high-capacity, industrial-grade FPGA option for designs that require significant programmable logic, on-chip memory and large I/O counts. Its Stratix IV family heritage, substantial logic and memory resources, and industrial temperature rating make it suitable for communications, signal processing and industrial control applications where integration and robustness are priorities.

For teams building scalable hardware platforms, this device offers the combination of programmable flexibility and documented architecture features to accelerate prototyping and deployment while keeping board-level complexity under control.

Request a quote or submit an inquiry to check availability, pricing and lead times for the EP4SE230F29I3G. Our team can provide specification support and ordering information to help you move from evaluation to production.