EP4SE230F29I4G

The EP4SE230F29I4G is an Intel Stratix IV family FPGA presented in a 780-ball FBGA package. It provides a high logic capacity and substantial on‑chip memory along with a large I/O count for complex, board-level programmable logic designs.

With 228,000 logic elements, approximately 17.5 Mbits of embedded memory and 488 I/O pins, this industrial‑grade device targets applications that require dense programmable logic, significant local memory, and broad external connectivity while operating across an extended temperature range.

Key Features

• Logic Capacity — 228,000 logic elements to implement complex custom logic, state machines, and data paths.
• Embedded Memory — Approximately 17.5 Mbits of on‑chip RAM for buffering, packet storage, and local data structures.
• I/O Density — 488 user I/O pins to support wide parallel buses and multiple peripheral interfaces.
• Package & Mounting — 780‑FBGA (29×29) package, surface mount, for high‑density board designs and compact system integration.
• Power Supply — Supported core voltage range from 870 mV to 930 mV for defined power budgeting and regulator selection.
• Operating Range & Grade — Industrial grade with an operating temperature span of −40 °C to 100 °C for thermally demanding environments.
• Standards & Compliance — RoHS compliant, meeting common environmental directives for lead‑free assembly.
• Stratix IV Family Capabilities — The Stratix IV device handbook documents architecture features common to the family such as high‑speed transceiver support, DSP blocks, PLLs and flexible clock networks, and comprehensive I/O options.

Typical Applications

• High‑performance communications — Dense logic and large embedded memory support packet processing, protocol handling, and interface bridging where many I/Os and on‑chip RAM are required.
• Digital signal processing — Substantial logic resources together with family DSP block support (as documented in the Stratix IV handbook) make the device suitable for filtering, signal conversion, and acceleration tasks.
• Instrument and test equipment — Broad I/O counts and industrial temperature rating enable reliable data acquisition, timing, and control in lab and field instruments.

Unique Advantages

• High logic and memory integration: 228,000 logic elements plus approximately 17.5 Mbits of embedded RAM reduce external component needs and simplify board-level architecture.
• Wide I/O accessibility: 488 I/O pins provide flexibility for parallel interfaces, memory buses, and multiple peripheral connections.
• Industrial reliability: Specified for −40 °C to 100 °C operation to support deployed systems in extended temperature environments.
• Compact BGA footprint: 780‑FBGA (29×29) enables a high‑density implementation while maintaining a standard surface‑mount form factor.
• Family ecosystem: Based on the Stratix IV device family documented in the device handbook, offering architectural features such as PLLs, clock networks, and high‑speed transceiver support referenced for system designers.
• Regulatory compliance: RoHS compliance supports lead‑free assembly and environmental requirements.

Why Choose EP4SE230F29I4G?

The EP4SE230F29I4G combines a high logic element count, substantial embedded RAM, and a large I/O complement in a single industrial‑grade BGA package—making it well suited for complex, space‑constrained designs that demand on‑chip memory and versatile interfacing. Its documented placement in the Stratix IV family provides designers with a known architectural baseline including transceiver and DSP capabilities as described in the family handbook.

This part is appropriate for engineering teams building demanding communications, DSP, and instrumentation systems that require scalability, robust thermal performance, and compliance with common environmental directives.

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