EP4SE360F35C2G

The EP4SE360F35C2G is a commercial-grade FPGA from Intel, based on the Stratix IV device family documented in the device handbook. It delivers a large configurable fabric and I/O capacity intended for high-bandwidth digital processing, complex logic integration, and systems requiring extensive on-chip memory and programmable logic.

Targeted use cases include high-performance communications, video and signal processing, and applications that leverage high-speed transceivers, dense logic, and substantial embedded memory to implement custom hardware functions and external memory interfaces.

Key Features

• Logic Capacity  Provides 353,600 logic elements for implementing large-scale logic, state machines, and custom datapaths.
• Embedded Memory  Includes approximately 23.1 Mbits of on-chip RAM to support buffers, FIFOs, and local storage for high-throughput designs.
• I/O Density  744 user I/O pins accommodate extensive external interfacing and board-level connectivity.
• Device Family Capabilities  Based on the Stratix IV architecture described in the device handbook, offering architecture features such as DSP blocks, clock networks, PLLs, and high-speed transceiver support.
• Power and Core Voltage  Operates with a core supply range of 870 mV to 930 mV, enabling tightly controlled core power design.
• Package and Mounting  1152-ball FBGA (35 × 35 mm) FCBGA package suitable for surface-mount PCB assembly.
• Operating Conditions  Commercial temperature range rated from 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• Telecommunications and Data Communications  Implements high-bandwidth packet processing, protocol acceleration, and external memory interfaces for network equipment.
• Video and Image Processing  Supports real-time video pipelines and frame buffering using the device’s large logic capacity and embedded RAM.
• High-Speed Interface Bridging  Serves as a programmable bridge for high-speed serial links and custom protocol endpoints leveraging the Stratix IV family’s transceiver and I/O capabilities.
• DSP and Accelerator Functions  Ideal for offloading compute-intensive algorithms to dedicated FPGA fabric and DSP resources within the Stratix IV architecture.

Unique Advantages

• Substantial Logic Resources: 353,600 logic elements enable complex system integration and large custom hardware implementations on a single device.
• Significant On‑Chip Memory: Approximately 23.1 Mbits of embedded RAM reduce external memory dependence for intermediate buffering and local storage.
• High I/O Count: 744 I/O pins provide flexibility for multi-channel interfaces and broad peripheral connectivity without multiple devices.
• Stratix IV Architecture: Leverages documented family features such as DSP blocks, PLLs, clock networks, and high-speed transceiver support for demanding signal-processing and interface tasks.
• Commercial Temperature and RoHS Compliance: Rated 0 °C to 85 °C and RoHS-compliant for mainstream commercial applications and standard manufacturing processes.
• Surface-Mount FBGA Packaging: 1152-ball FCBGA (35 × 35 mm) package supports high-density board designs and automated assembly.

Why Choose EP4SE360F35C2G?

The EP4SE360F35C2G positions itself for designs that require extensive programmable logic, generous embedded memory, and high I/O density within a commercial-temperature FPGA. Its alignment with the Stratix IV device family provides architecture-level features useful for DSP, high-speed I/O, and complex system integration while keeping power and board-level design considerations explicit through its core voltage and package specifications.

This device is suitable for engineering teams building high-throughput communications, video processing, or accelerator modules that benefit from a single-chip, highly configurable solution backed by Intel’s device documentation and ecosystem.

Request a quote or submit a procurement inquiry to confirm pricing, availability, and lead time for EP4SE360F35C2G.