EP4SE360F35C3N

The EP4SE360F35C3N is a STRATIX® IV E Field Programmable Gate Array (FPGA) IC offering a high-density programmable logic fabric in a ball grid array package. It provides substantial logic capacity, on-chip RAM and a large I/O complement for designs that require significant programmable resources.

Built for surface-mount applications, this commercial-grade device combines 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 744 I/O pins in a 1152-BBGA (35×35) package, with a core supply voltage range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity – 353,600 logic elements to implement large-scale custom logic and complex state machines.
• Embedded Memory – Approximately 23.1 Mbits of on-chip RAM for buffers, FIFOs, and embedded data storage.
• I/O Density – 744 I/O pins to support extensive external interfaces and parallel connectivity.
• Package – 1152-BBGA, FCBGA (supplier package: 1152-FBGA 35×35) designed for high-pin-count surface-mount applications.
• Power – Core voltage supply range of 870 mV to 930 mV to match system power requirements.
• Operating Range – Commercial-grade operation from 0 °C to 85 °C for standard embedded and industrial-adjacent environments.
• Mounting and Compliance – Surface-mount device with RoHS compliance for regulatory and assembly considerations.

Typical Applications

• High-density programmable logic systems – Implement large custom logic blocks and complex digital functions that benefit from extensive logic and memory resources.
• Data buffering and on-chip memory – Use the approximately 23.1 Mbits of embedded RAM for data buffering, packet queues or protocol FIFOs.
• Multi-interface designs – Leverage 744 I/O pins to connect to numerous peripherals, buses or parallel interfaces in a single device.
• Prototype and development platforms – Evaluate and validate large-scale logic and I/O configurations during product development.

Unique Advantages

• High logic density: 353,600 logic elements enable consolidation of multiple functions into a single FPGA, reducing system complexity.
• Significant on-chip memory: Approximately 23.1 Mbits of embedded RAM minimizes external memory requirements and improves latency.
• Extensive I/O count: 744 I/Os support broad connectivity options without additional expander components.
• Compact, high-pin-count package: 1152-BBGA (35×35) delivers a high pin density in a surface-mount form factor for space-constrained boards.
• Commercial operating range: 0 °C to 85 °C supports standard embedded applications while simplifying thermal design considerations.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose EP4SE360F35C3N?

The EP4SE360F35C3N equips designers with a high-capacity STRATIX® IV E FPGA platform that balances large programmable logic, substantial embedded memory and wide I/O support in a single surface-mount package. Its combination of 353,600 logic elements, approximately 23.1 Mbits of RAM and 744 I/Os makes it well suited for designs that require consolidation of multiple digital functions and heavy I/O integration.

As a commercial-grade Intel FPGA in a 1152-BBGA package with RoHS compliance, it is a practical choice for embedded systems, prototype platforms, and other applications where high logic density, on-chip memory and extensive connectivity are primary requirements.

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