EP4SE360F35I3

The EP4SE360F35I3 is a STRATIX® IV E Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA (FCBGA) package. It delivers a high-density programmable fabric suited to designs that require large logic capacity, significant on-chip memory, and substantial I/O connectivity.

With 353,600 logic elements, approximately 23.1 Mbits of embedded memory and 744 I/O, this industrial-grade device targets high-density compute and I/O‑intensive applications that operate across a broad temperature range and require RoHS compliance.

Key Features

• Logic Capacity — 353,600 logic elements to implement large and complex FPGA designs.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM to support buffering, look-up tables and local storage.
• I/O Count — 744 I/O pins suitable for designs requiring extensive external interfacing and parallel connectivity.
• Power/Voltage — Core voltage supply range of 870 mV to 930 mV, enabling designs that target this specific core-power domain.
• Package & Mounting — 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35); surface-mount mounting type for standard PCB assembly.
• Operating Range & Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C for demanding environments.
• Environmental Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-performance networking equipment — Use the device’s large logic capacity and abundant I/O to implement packet processing, switching fabrics and protocol handling.
• Telecommunications infrastructure — Leverage the on-chip memory and logic resources to support buffering, framing and control functions in telecom systems.
• High-density embedded systems — Integrate complex control, data-path and interface logic into a single FPGA for compact system designs.
• Industrial control and automation — Industrial grade temperature range and extensive I/O make this FPGA suitable for automation controllers and gate-array based system controllers.

Unique Advantages

• Large programmable fabric: 353,600 logic elements provide the headroom to consolidate multiple functions into a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 23.1 Mbits of on-chip RAM supports local buffering and high-throughput data handling without immediate external memory dependence.
• Extensive I/O capability: 744 I/O pins enable broad connectivity to peripherals, mezzanine modules and high-pin-count interfaces.
• Industrial operating range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging deployments.
• Industry-standard package and mounting: 1152-BBGA / 1152-FBGA (35×35) surface-mount package supports common assembly and thermal strategies.
• Regulatory alignment: RoHS compliance simplifies integration into products targeting regulated markets.

Why Choose EP4SE360F35I3?

The EP4SE360F35I3 positions itself as a high-density STRATIX® IV E FPGA option for designs that require a large number of logic elements, significant on-chip memory and wide I/O capability within an industrial temperature envelope. Its combination of capacity, package options and RoHS compliance makes it suitable for system-level consolidation in communications, networking and industrial applications.

This FPGA is appropriate for engineering teams seeking a scalable, programmable solution to replace multi-chip implementations or to centralize complex logic and memory functions. The device’s specified voltage range, package details and operating temperature make it straightforward to validate for long-term deployments within the stated constraints.

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