EP4SE360F35I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 723 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SE360F35I4G – Field Programmable Gate Array (FPGA) IC
The EP4SE360F35I4G is a Stratix IV family Field Programmable Gate Array (FPGA) IC from Intel, offering a high-capacity programmable fabric for complex digital designs. It combines a large logic element count, substantial on-chip memory, and a high I/O count in a 1152-ball FBGA package suited for industrial applications.
This device targets designs that require high aggregate data bandwidth, extensive I/O connectivity, and robust operation across an industrial temperature range. Its architecture and feature set support integration of memory interfaces, signal-processing blocks and high-speed transceiver functions described in the Stratix IV device handbook.
Key Features
- Logic Capacity Contains 353,600 logic elements (cells) to implement large, complex digital designs.
- Embedded Memory Approximately 23.1 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
- I/O Density 744 user I/O pins enable wide device connectivity for external peripherals, memory, and high-pin-count interfaces.
- Industrial Grade & Temperature Range Industrial-grade device rated for operation from –40°C to 100°C for use in demanding environmental conditions.
- Low-Voltage Core Core supply specified at 870 mV to 930 mV to match system power-rail planning and thermal design.
- Package & Mounting 1152-ball FBGA package (35 × 35 mm) in a surface-mount FCBGA form factor for high-density PCB integration.
- Stratix IV Architecture Device handbook references indicate architecture features such as high-speed transceiver support, DSP resources, advanced clocking/PLL structures, and external memory interface capabilities.
- Standards Compliance RoHS-compliant manufacturing to meet environmental regulations.
Typical Applications
- High‑speed networking equipment Leverages the Stratix IV transceiver and bandwidth-oriented architecture for packet processing, switching and line-card designs.
- Signal processing and DSP Uses the device’s large logic fabric and embedded memory for real‑time filtering, transforms, and custom DSP pipelines.
- Memory interface controllers Implements external memory controllers and buffering schemes using abundant I/O and on-chip RAM.
- Industrial control systems Provides robust operation across –40°C to 100°C and extensive I/O for sensor, actuator and motor‑control interfaces.
Unique Advantages
- High logic density: 353,600 logic elements support complex system-on-chip implementations and hardware acceleration of compute‑intensive tasks.
- Significant embedded memory: Approximately 23.1 Mbits of RAM reduces dependence on external memory for intermediate buffering and low‑latency data paths.
- Extensive I/O capacity: 744 I/O pins enable direct interfacing to multiple peripherals, parallel buses and memory devices without excessive bridge logic.
- Industrial operating range: Rated for –40°C to 100°C operation for reliable deployment in harsh environments.
- Compact, high-density packaging: 1152‑ball FBGA (35×35 mm) allows for high-pin-count integration in space-constrained PCBs.
- Controlled core voltage: 870 mV–930 mV supply range supports integrated power designs and predictable thermal management.
Why Choose EP4SE360F35I4G?
The EP4SE360F35I4G positions itself as a high-capacity Stratix IV FPGA solution for engineers who need a combination of large logic resources, substantial embedded memory and a high I/O count in an industrial-grade package. Its specifications are suited for applications that require extensive on-chip resources alongside robust environmental tolerance.
Design teams building networking, signal processing, memory interface, or industrial control applications can leverage the device’s architecture and the technical details documented in the Stratix IV device handbook to integrate complex functions while managing board-level density and power. The EP4SE360F35I4G offers a scalable, well-documented platform for long‑lifecycle designs backed by Intel’s Stratix IV device documentation.
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