EP4SE360H29C2
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 23105536 353600 780-BBGA, FCBGA |
|---|---|
| Quantity | 329 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SE360H29C2 – STRATIX® IV E Field Programmable Gate Array (FPGA) IC 488 23105536 353600 780-BBGA, FCBGA
The EP4SE360H29C2 is a Stratix IV E family FPGA offering high-density programmable logic with 353,600 logic elements and approximately 23.1 Mbits of embedded memory. The device targets complex digital designs that require large on-chip memory, substantial I/O, and comprehensive device-level features documented in the Stratix IV device handbook.
Built in a 780-ball FCBGA package with a 33×33 supplier package outline, this commercial-grade, RoHS-compliant FPGA provides a compact surface-mount solution for high-capacity programmable systems operating within a 0 °C to 85 °C range and a core supply of 870 mV to 930 mV.
Key Features
- Core logic capacity — 353,600 logic elements for high-density logic implementation and complex FPGA designs.
- Embedded memory — Approximately 23.1 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
- I/O and connectivity — 488 user I/O pins providing wide external interfacing options for multi‑domain systems.
- Power and supply — Core supply voltage specified from 870 mV to 930 mV, enabling controlled core-power design and power-budget planning.
- Package and mounting — 780-BBGA (FCBGA) package; supplier device package listed as 780-HBGA (33×33); surface-mount mounting for dense PCB implementations.
- Operating conditions — Commercial-grade device rated for 0 °C to 85 °C operation.
- Standards and compliance — RoHS-compliant for regulatory environmental requirements.
- Documented device features — Device handbook content includes electrical characteristics, recommended operating conditions, DC/switching specifications, PLL and clock-tree details, DSP block and TriMatrix memory specifications, transceiver performance, and configuration/JTAG descriptions to aid system design and verification.
Typical Applications
- High-density digital systems — Use the large logic element count and abundant embedded memory to consolidate complex logic and system functions into a single FPGA.
- Signal processing and acceleration — On-chip memory and documented DSP block specifications support implementations that require embedded data storage and arithmetic processing.
- High-speed connectivity — Transceiver and interface sections in the device documentation support designs requiring significant I/O and datapath integration.
- Prototyping and system integration — The combination of extensive logic, memory, and I/O makes the device suitable for board-level prototyping and integrating multiple subsystems.
Unique Advantages
- Substantial on-chip resources: 353,600 logic elements and ~23.1 Mbits of RAM reduce the need for external logic and memory, simplifying BOM and PCB layout.
- High I/O count: 488 user I/Os enable broad interfacing options for multi‑lane, multi-protocol systems and peripheral-rich designs.
- Compact FCBGA footprint: 780-ball package in a 33×33 outline provides a high-density, surface-mount solution for space-constrained boards.
- Design guidance included: The Stratix IV device handbook content covers PLLs, clocking, DC/switching characteristics, DSP and memory block specs to support predictable integration and timing closure.
- Environmental compliance: RoHS status simplifies regulatory compliance for products distributed in regions requiring lead-free materials.
- Commercial operating range: Rated for 0 °C to 85 °C operation, aligning with many commercial electronic product requirements.
Why Choose EP4SE360H29C2?
The EP4SE360H29C2 positions itself as a high-capacity Stratix IV E FPGA for designs that demand substantial programmable logic, embedded memory, and a large I/O footprint in a compact surface-mount BGA package. Its combination of 353,600 logic elements, approximately 23.1 Mbits of on-chip RAM, and comprehensive device documentation supports complex system integration and board-level consolidation.
This device is well suited to engineering teams and procurement organizations implementing commercial-grade, high-density FPGA designs that benefit from documented PLL, DSP, transceiver, and memory block specifications for system planning, power budgeting, and timing analysis.
If you would like pricing or availability for EP4SE360H29C2, request a quote or submit your procurement inquiry referencing the full part number.

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