EP4SE360F35I4N

The EP4SE360F35I4N is a STRATIX® IV E field programmable gate array (FPGA) in a 1152-BBGA FCBGA package, designed for demanding industrial applications. It provides a large programmable fabric with 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 744 user I/O to support complex digital systems.

Architected for integration and flexibility, the device includes on-chip features documented in the Stratix IV device handbook—such as PLLs, DSP blocks, TriMatrix memory blocks, transceivers, and configuration/JTAG support—enabling a wide range of system-level implementations where high logic density and extensive I/O are required.

Key Features

• Logic Capacity  353,600 logic elements suitable for large-scale combinational and sequential designs.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM for buffering, FIFOs, and distributed storage.
• I/O Resources  744 user I/O pins to interface with multiple peripherals, sensors, and external devices.
• On-chip System Blocks  Includes PLL specifications, DSP block specifications, TriMatrix memory blocks, transceiver performance specifications, and clock tree specifications as documented in the device handbook.
• Configuration and Debug  Supports device configuration and JTAG for programming and boundary-scan/debug functionality.
• Package and Mounting  1152-BBGA (1152-FBGA, 35×35) surface-mount package suitable for dense PCB layouts.
• Power Supply  Core supply range documented at 870 mV to 930 mV to match system power planning requirements.
• Operating Range  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• System Reliability Features  Device handbook includes specifications for power, switching characteristics, temperature sensing diode, and a chip-wide reset (Dev_CLRn) to assist robust system design.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature range and high logic density accommodate control, sequencing, and sensor/actuator interfacing for factory and process automation.
• Communications and Networking  On-chip transceiver specifications and abundant I/O support protocol implementation and I/O aggregation for network infrastructure equipment.
• Signal Processing and Acceleration  DSP block specifications and substantial embedded memory make the device suitable for fixed-function and programmable signal-processing pipelines.

Unique Advantages

• Large Programmable Fabric: 353,600 logic elements provide the capacity to implement complex state machines, wide datapaths, and substantial custom logic blocks.
• Generous Embedded Memory: Approximately 23.1 Mbits of on-chip RAM reduces external memory dependence for buffering and latency-sensitive storage.
• Extensive I/O Count: 744 user I/Os enable broad peripheral interfacing and parallel connectivity without extensive external multiplexing.
• Integrated System Blocks: Built-in PLLs, DSP blocks, TriMatrix memory blocks, transceivers, and configuration/JTAG support streamline system design and reduce external component count.
• Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployments in industrial and temperature-variable environments.
• Compact High-Density Package: 1152-BBGA FCBGA package delivers high pin count in a compact footprint for space-constrained PCBs.

Why Choose EP4SE360F35I4N?

The EP4SE360F35I4N combines a very large logic element count, substantial on-chip memory, and a high I/O complement in an industrial-grade FPGA package. Its documented device-level features (PLLs, DSP resources, TriMatrix memory blocks, transceivers, clock tree and configuration/JTAG support) provide the building blocks needed for sophisticated digital systems while helping to minimize external components.

This device is well suited for engineering teams building complex industrial, communications, or signal-processing systems that require a scalable, programmable fabric with robust operating temperature margins and a compact, high-pin-count package. The combination of integration and documented device-level specifications supports long-term design scalability and maintainability.

Request a quote or submit an inquiry to receive pricing and availability for EP4SE360F35I4N and support for your specific design requirements.