EP4SE360H29C3

The EP4SE360H29C3 is a STRATIX® IV E field programmable gate array (FPGA) offered in a 780‑ball BGA FCBGA package for surface‑mount applications. It is a commercial‑grade programmable logic device designed to deliver large on‑chip logic and memory resources with a high I/O count for complex digital designs.

Key device attributes include 353,600 logic elements, approximately 23.1 Mbits of embedded RAM, up to 488 user I/Os, and a documented supply range of 870 mV to 930 mV, all rated for operation from 0 °C to 85 °C.

Key Features

• Logic Capacity  353,600 logic elements provide substantial programmable logic resources for complex combinational and sequential designs.
• Embedded Memory  Approximately 23.1 Mbits of on‑chip RAM to support large buffering, lookup tables, and on‑chip data storage.
• I/O Density  Up to 488 user I/Os for broad connectivity to external devices, peripherals, and high‑pin‑count interfaces.
• Power Supply  Documented core voltage supply range from 870 mV to 930 mV for devices designed around this operating window.
• Package & Mounting  780‑BBGA (FCBGA) package, supplier device package shown as 780‑HBGA (33×33), intended for surface‑mount PCB assembly.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation, suitable for commercial applications.
• Regulatory  RoHS compliant.

Typical Applications

• Commercial FPGA designs  Deploy where high logic density and substantial embedded memory are required for feature‑rich, programmable systems.
• Embedded systems  Use the device to implement large custom logic blocks and on‑chip buffering in commercial embedded products operating within 0 °C to 85 °C.
• High‑I/O systems  Suitable for designs that require up to 488 user I/Os to connect multiple external interfaces and peripherals.

Unique Advantages

• High logic density: 353,600 logic elements enable complex logic implementations on a single FPGA, reducing the need for multiple devices.
• Large on‑chip memory: Approximately 23.1 Mbits of embedded RAM supports extensive buffering, data manipulation, and lookup storage without external memory.
• Extensive I/O count: 488 user I/Os allow broad connectivity and flexible interfacing options for multifaceted designs.
• Compact surface‑mount package: 780‑ball BGA (FCBGA) packaging with a 33×33 supplier package footprint supports dense PCB layouts and standard SMT assembly.
• Commercial operating range: Rated for 0 °C to 85 °C, aligning with commercial product deployment requirements.
• RoHS compliant: Conforms to RoHS requirements for environmental and manufacturing considerations.

Why Choose EP4SE360H29C3?

EP4SE360H29C3 combines substantial programmable logic resources, significant embedded memory capacity, and a high I/O count within a 780‑ball FCBGA surface‑mount package, making it a focused option for commercial designs that require integration of complex digital functions on a single device. Its documented supply voltage window and commercial temperature rating provide clear engineering constraints for system-level power and thermal planning.

This device is well suited for design teams targeting high‑capacity programmable solutions in commercial applications where on‑chip memory, logic density, and I/O connectivity are primary selection criteria.

Request a quote or submit an inquiry to obtain pricing and availability for EP4SE360H29C3.