EP4SE360H29C4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 702 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SE360H29C4G – * Field Programmable Gate Array (FPGA) IC
The EP4SE360H29C4G is a high-density FPGA from Intel, delivered in a 780‑pin FCBGA/HBGA package and documented within the Stratix IV device family handbook. It provides a large logic fabric and substantial on-chip memory suitable for designs that require high aggregate data bandwidth, extensive I/O, and dense logic integration.
With 353,600 logic elements, approximately 23.1 Mbits of embedded memory and 488 general-purpose I/O pins, this device targets applications requiring significant programmable logic capacity, on-chip RAM, and board-level integration while operating within commercial temperature and voltage ranges.
Key Features
- Logic Capacity – 353,600 logic elements to implement large, complex digital designs and custom processing pipelines.
- Embedded Memory – Approximately 23.1 Mbits (23,105,536 bits) of on-chip RAM for buffering, frame storage, and intermediate data processing.
- I/O Density – 488 I/O pins to support wide parallel interfaces, multiple external peripherals, and flexible board-level connectivity.
- Package and Mounting – Supplied in a 780‑HBGA (33×33) / 780‑BBGA FCBGA package, designed for surface-mount assemblies.
- Power and Operating Range – Core supply range of 870 mV to 930 mV and commercial operating temperature range of 0 °C to 85 °C.
- Compliance – RoHS‑compliant component meeting common environmental requirements for commercial electronic products.
- Stratix IV Family Architecture – The Stratix IV Device Handbook documents family-level features such as embedded memory, DSP blocks, PLLs, clock networks and high‑speed transceiver support that define the architecture this device is based on.
Typical Applications
- High‑bandwidth Networking: Use the large logic capacity and numerous I/Os to implement packet processing, switching logic, and protocol handling for communications equipment.
- Signal Processing and DSP: Deploy on-chip memory and abundant logic elements to accelerate real‑time filtering, transforms, and data-path operations.
- System Integration and Prototyping: Integrate multiple custom IP blocks and external interfaces on a single device for rapid system prototyping and consolidation of discrete components.
- High‑performance Embedded Control: Leverage dense logic and wide I/O to implement complex control systems, multi‑axis motor control, or custom SoC functions.
Unique Advantages
- High logic density: 353,600 logic elements enable large-scale designs without partitioning across multiple devices, reducing board complexity.
- Substantial on‑chip RAM: Approximately 23.1 Mbits of embedded memory supports deep buffering and on‑device data storage for latency-sensitive applications.
- Extensive I/O count: 488 I/Os provide flexibility for parallel interfaces, multi‑lane connections, and rich peripheral integration.
- Surface‑mount BGA packaging: 780‑pin HBGA/FCBGA package allows high pin density in a compact footprint for modern PCB layouts.
- Documented family architecture: Inclusion in the Stratix IV Device Handbook gives access to architecture-level documentation covering transceivers, DSP blocks, clocking and system features.
- Commercial‑grade specification: Rated for 0 °C to 85 °C operating range and RoHS compliance for standard commercial deployments.
Why Choose EP4SE360H29C4G?
The EP4SE360H29C4G offers a balanced combination of high logic element count, on‑chip memory capacity and extensive I/O in a BGA package, making it well suited for developers building high‑throughput, integrated FPGA systems. Its placement within the Stratix IV family provides documented architecture features relevant to high‑performance logic and signal processing applications.
This device is appropriate for engineering teams and procurement focused on compact, high‑density FPGA solutions for commercial applications that demand significant programmable logic, embedded RAM and broad I/O connectivity. Available documentation and family-level resources support system design and integration.
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