EP4SE360H29I3

The EP4SE360H29I3 is an industrial-grade STRATIX® IV E field-programmable gate array (FPGA) IC. It implements the Stratix IV E device family architecture and delivers a high degree of integration through large logic capacity, abundant I/O, and on-chip memory.

With 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 488 I/O pins in a 780-BBGA FCBGA package, this device addresses designs that require extensive programmable logic, multi‑interface connectivity, and operation across an industrial temperature range.

Key Features

• Core Logic — 353,600 logic elements provide significant programmable fabric for complex logic and system integration.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM to support buffering, state storage, and memory-mapped logic functions.
• I/O and Interfaces — 488 I/O pins enable multiple parallel interfaces and external device connectivity in a single FPGA package.
• Package and Mounting — 780‑BBGA, FCBGA package (supplier device package: 780‑HBGA, 33×33) designed for surface-mount assembly.
• Power — Supported core voltage supply range from 870 mV to 930 mV for the device core voltage domain.
• Temperature and Grade — Industrial grade with operating temperature range −40 °C to 100 °C for deployment in thermally demanding environments.
• Standards and Compliance — RoHS status: Compliant.
• Device Family Features (from datasheet) — Stratix IV device handbook documents family-level capabilities including embedded memory, DSP blocks, PLLs, clock networks, high-speed transceivers, and external memory interfaces.

Typical Applications

• High‑capacity FPGA systems — Use the large logic element count and on-chip RAM for complex programmable systems and heavy logic integration.
• Multi‑I/O interface hubs — Leverage 488 I/O pins to consolidate multiple peripheral and bus interfaces within a single device.
• Signal processing and DSP — Implement DSP pipelines and buffering using the device family’s documented DSP block and embedded memory capabilities.
• Memory‑interface designs — Employ the Stratix IV family’s external memory interface features for designs requiring structured memory access and high aggregate bandwidth.

Unique Advantages

• Large programmable capacity: 353,600 logic elements allow substantial logic integration and consolidation of multiple functions into one FPGA.
• Significant on‑chip memory: Approximately 23.1 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Broad I/O count: 488 I/O pins permit flexible connectivity and simplify board-level routing for multi‑interface systems.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Surface-mount, high-density package: 780‑BBGA / 780‑HBGA (33×33) package enables high-density PCB implementations while keeping a compact board footprint.
• Documented family features: Datasheet and device handbook detail family-level resources such as PLLs, clock networks, DSP blocks, and high-speed transceiver support for system design planning.

Why Choose EP4SE360H29I3?

The EP4SE360H29I3 positions itself as an industrial-grade Stratix IV E FPGA offering substantial logic and memory resources combined with a high I/O count and a compact 780‑BBGA FCBGA package. Its documented family features—covering embedded memory, DSP blocks, clocking resources, and transceiver support—make it suitable for designs that require dense programmable logic, multiple interfaces, and robust temperature tolerance.

This device is a practical choice for engineering teams targeting large-scale programmable integration, system consolidation, and designs that benefit from the Stratix IV E family’s documented capabilities and industrial temperature rating.

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