EP4SE360H29I4

The EP4SE360H29I4 is a STRATIX® IV E Field Programmable Gate Array (FPGA) in a 780-ball BGA package designed for industrial-grade applications. It provides high-density programmable logic, substantial on-chip memory, and a large I/O count for complex, integrated digital designs that require robust thermal and voltage operating ranges.

Key Features

• High-density logic 353,600 logic elements deliver large-scale programmable logic capacity for complex custom functions.
• Logic block count 14,144 CLBs provide the building blocks for implementing wide-ranging logic architectures.
• Embedded memory Approximately 23.1 Mbits of on-chip RAM to support data buffering, look-up tables, and local storage needs.
• I/O resources 488 general-purpose I/Os enable extensive system connectivity and peripheral interfacing.
• Package options 780-BBGA, FCBGA package; supplier device package 780-HBGA (33×33) supports high-density board integration.
• Power Specified core voltage supply range of 870 mV to 930 mV for defined power planning and supply design.
• Industrial temperature range Rated for operation from −40 °C to 100 °C to support deployment in demanding environmental conditions.
• Mounting and compliance Surface-mount device construction and RoHS compliance for modern PCB assembly and environmental standards.

Typical Applications

• Industrial control systems — Use the device’s industrial temperature rating and large logic capacity for control logic, signal processing, and I/O consolidation in factory equipment and automation.
• Communication and networking equipment — Leverage high logic density and substantial embedded RAM to implement protocol handling, buffering, and custom packet processing.
• Data processing and acceleration — Employ the abundant logic elements and on-chip memory for custom compute kernels, data-path acceleration, and algorithm implementation.

Unique Advantages

• Large programmable capacity: 353,600 logic elements support complex, multi-function designs without immediate need to partition across devices.
• Significant embedded memory: Approximately 23.1 Mbits of on-chip RAM reduces external memory dependency and simplifies board-level memory design.
• Extensive I/O integration: 488 I/Os enable direct interfacing to a wide array of peripherals and subsystems, minimizing glue logic.
• Industrial-ready thermal range: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable environments.
• Compact, high-density package: 780-BBGA / 780-HBGA (33×33) package allows high pin-count routing in space-constrained PCB layouts.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose EP4SE360H29I4?

The EP4SE360H29I4 positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial logic resources, ample on-chip memory, and a robust operating envelope. Its combination of 353,600 logic elements, approximately 23.1 Mbits of embedded RAM, and 488 I/Os makes it suitable for engineers building complex control, communications, or data-processing systems that demand integration and thermal resilience.

For teams prioritizing scalability and board-level integration, the 780-ball BGA package and defined voltage and temperature ranges simplify hardware planning and deployment. This part is appropriate for projects where on-chip resources and industrial operating conditions are key selection criteria.

Request a quote or submit a procurement inquiry to receive pricing and availability for EP4SE360H29I4.