EP4SE360H29I4N

The EP4SE360H29I4N is a Stratix® IV E family Field Programmable Gate Array (FPGA) in a 780-BBGA FCBGA package. It delivers a high-density programmable fabric with 353,600 logic elements and substantial on-chip memory for complex, integration-heavy designs.

Targeted for industrial systems, the device provides 488 user I/Os, surface-mount packaging, and an operating range intended for robust environments. Its core supply and thermal specifications support designs that require tight control over power and temperature margins.

Key Features

• Logic Density — 353,600 logic elements to implement large-scale digital designs, state machines, and custom accelerators.
• Embedded Memory — Approximately 22 Mbits of embedded memory (23,105,536 total RAM bits) for buffering, on-chip data storage, and complex state retention.
• I/O Count — 488 user I/Os to support wide parallel interfaces, control buses, and mixed-signal peripherals at the board level.
• Package & Mounting — 780-BBGA FCBGA package (supplier device package: 780-HBGA 33×33) designed for surface-mount assembly on compact, high-density PCBs.
• Core Voltage — Core supply range of 870 mV to 930 mV, enabling designs that manage core power rails precisely.
• Temperature Range — Industrial-grade operating temperature from −40 °C to 100 °C for deployment in demanding environmental conditions.
• Compliance — RoHS compliant, aligning with common environmental compliance requirements.

Typical Applications

• High-density signal processing — Use the device’s large logic count and embedded memory for FPGA-based signal pipelines, buffering, and real-time data manipulation.
• Networking & Telecom infrastructure — High I/O count and large programmable fabric support protocol handling, packet processing, and custom interface bridging.
• Industrial control and automation — Industrial-grade temperature range and surface-mount packaging make it suitable for control systems, motor drives, and factory automation logic.
• Test & measurement systems — Flexible I/O and on-chip memory enable acquisition front-ends, trigger logic, and data pre-processing on-board.

Unique Advantages

• High logic capacity: 353,600 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity and BOM count.
• Significant on-chip memory: Approximately 22 Mbits of embedded RAM reduces external memory dependencies and improves deterministic data paths.
• Extensive I/O integration: 488 user I/Os provide flexibility to connect to a wide range of peripherals and parallel interfaces without additional I/O expanders.
• Industrial thermal range: Rated for −40 °C to 100 °C operation to support deployment in harsher environments where extended temperature tolerance is required.
• Compact, manufacturable package: 780-BBGA FCBGA (780-HBGA 33×33) supports high-density PCB layouts and standard surface-mount assembly processes.
• Environmental compliance: RoHS compliance helps meet regulatory and customer product stewardship requirements.

Why Choose EP4SE360H29I4N?

The EP4SE360H29I4N is positioned for engineers and system designers who need a high-density Stratix IV E FPGA with substantial logic and embedded memory in a manufacturable FCBGA package. Its combination of 353,600 logic elements, approximately 22 Mbits of on-chip RAM, and 488 I/Os makes it a strong candidate for designs that consolidate multiple functions and require on-chip data buffering.

With an industrial operating temperature range, a controlled core supply window, and RoHS compliance, this device delivers predictable, repeatable behavior for long-life industrial deployments while aligning with environmental requirements. Documentation for the Stratix IV family is available in the device handbook to support design integration and system qualification.

Request a quote or submit an inquiry for pricing and availability of EP4SE360H29I4N. Our team can provide lead-time and ordering information to support your design schedule.