EP4SE530F43C3

The EP4SE530F43C3 is a Stratix IV E FPGA from Intel, delivering high-density programmable logic and a broad set of architecture features suitable for demanding digital designs. Its combination of large logic capacity, significant on-chip memory, and abundant I/O makes it suited to high-bandwidth data processing, communications, and complex system integration.

Built on the Stratix IV E device family architecture, this FPGA addresses applications that require substantial logic resources, embedded memory, and flexible I/O while operating within commercial temperature and voltage ranges.

Key Features

• Core Logic Density  Provides 531,200 logic elements to implement large-scale digital functions and complex state machines.
• Embedded Memory  Includes approximately 28 Mbits of on-chip RAM for buffering, frame storage, and data-path acceleration.
• I/O Capacity  Offers 1,120 user I/O pins to interface with external devices, memory, and high-speed peripherals.
• Package & Mounting  Supplied in a 1760-FCBGA (42.5 × 42.5 mm) package, optimized for surface-mount PCB integration where high pin count and density are required.
• Power  Core supply range from 870 mV to 930 mV, enabling standardized power provisioning for the device core.
• Operating Conditions & Grade  Commercial-grade device rated for 0 °C to 85 °C ambient operation and RoHS compliant for environmental compatibility.
• Architecture Highlights  Part of the Stratix IV E family; documented device features include embedded memory, DSP blocks, PLLs, high-speed transceivers, and comprehensive I/O capabilities for system-level integration.

Typical Applications

• High-bandwidth Communications  Use the FPGA's large logic array and I/O count to implement protocol bridging, packet processing, and aggregation functions.
• Signal Processing & DSP Acceleration  Leverage the device family’s DSP and embedded memory resources for real-time filtering, transforms, and algorithm acceleration.
• Memory Interfaces & Controllers  Deploy for designs that require external memory interfacing and buffering using the on-chip RAM and abundant I/O.
• Complex System Integration  Ideal for consolidating multiple digital functions onto a single silicon device where high logic density and many I/O are needed.

Unique Advantages

• High logic capacity: Large pool of logic elements enables implementation of complex, multi-function designs on a single device.
• Significant embedded memory: Approximately 28 Mbits of on-chip RAM reduces dependence on external memory for many buffering and data-path tasks.
• Extensive I/O: 1,120 I/Os provide the connectivity required for dense system-level interconnects and external interfaces.
• Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) supports high pin-count applications while enabling surface-mount PCB assembly.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial electronic products and systems.
• RoHS compliant: Meets environmental compliance requirements for lead-free material content.

Why Choose EP4SE530F43C3?

The EP4SE530F43C3 positions itself as a high-density Stratix IV E FPGA option for designs demanding substantial logic resources, embedded memory, and broad I/O connectivity within commercial temperature limits. Its documented architecture features—such as DSP blocks, PLLs, and high-speed transceiver capability within the Stratix IV family—support integration of complex signal-processing and high-bandwidth functions.

This device is well suited to engineering teams building data-processing, communications, or integration-focused systems that require a single-chip programmable solution backed by Intel’s Stratix IV device documentation and ecosystem. Its combination of logic capacity, embedded memory, and I/O makes it a practical choice for scalable designs that prioritize integration and performance within commercial environmental ranges.

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