EP4SE530F43C3N

The EP4SE530F43C3N is a STRATIX® IV E field programmable gate array (FPGA) from Intel, delivered in a 1760-ball FCBGA package (42.5 × 42.5 mm). It provides a high-density programmable logic fabric with 531,200 logic elements and approximately 28 Mbits of embedded memory, along with a broad I/O count for complex system designs.

Designed for commercial-temperature applications, this surface-mount FPGA targets designs that require large on-chip logic and memory resources while operating within a 0 °C to 85 °C range and a core supply of 870 mV to 930 mV.

Key Features

• Programmable Logic Capacity 531,200 logic elements to implement large-scale digital functions and custom datapaths.
• Embedded Memory Approximately 28 Mbits of on-chip RAM, enabling substantial buffering, lookup tables, and state storage without external memory dependency.
• I/O Density 1,120 available I/O pins to support wide parallel interfaces, multiple high-pin-count peripherals, and complex board-level connectivity.
• Power and Voltage Core voltage supply range of 870 mV to 930 mV, allowing precise power planning and supply selection for the FPGA core.
• Package and Mounting 1760-FCBGA (42.5 × 42.5 mm) package in a surface-mount form factor, suitable for compact, high-density PCB layouts.
• Operating Conditions Commercial grade device specified for 0 °C to 85 °C operation and compliant with RoHS requirements.

Typical Applications

• High-density digital processing — Large-scale logic capacity and on-chip memory support complex processing engines and custom accelerators.
• Interface aggregation and bridging — High I/O count enables aggregation of multiple parallel or serialized interfaces for protocol conversion and system integration.
• Data buffering and packet processing — Substantial embedded RAM supports buffering, queuing, and stateful packet handling within the FPGA fabric.

Unique Advantages

• Extensive logic resources: 531,200 logic elements provide the headroom needed for large, multi-function FPGA designs without immediate redesign.
• Significant embedded memory: Approximately 28 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage requirements.
• High I/O integration: 1,120 I/O pins allow direct connectivity to numerous peripherals and high-bandwidth interfaces, simplifying board-level routing.
• Compact, industry-standard package: 1760-FCBGA (42.5 × 42.5 mm) delivers high integration density in a surface-mount form factor suitable for space-constrained PCBs.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation, matching typical commercial-product environmental requirements.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious designs and supply-chain compliance.

Why Choose EP4SE530F43C3N?

The EP4SE530F43C3N positions itself as a high-density STRATIX IV E FPGA option for commercial designs that require large programmable logic capacity, substantial on-chip memory, and broad I/O integration. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 1,120 I/O makes it well suited to complex digital processing, interface aggregation, and buffering-intensive applications.

With a compact 1760-FCBGA package and defined operating ranges, this FPGA provides a reliable building block for teams looking to scale logic-heavy designs while maintaining clear power and thermal planning parameters.

Request a quote or submit a procurement inquiry for EP4SE530F43C3N to get pricing and availability details for your design requirements.