EP4SE530F43C4
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 1120 28033024 531200 1760-BBGA, FCBGA |
|---|---|
| Quantity | 78 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 1120 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SE530F43C4 – STRATIX® IV E FPGA, 531,200 logic elements, 1760-FCBGA
The EP4SE530F43C4 is a Stratix IV E field-programmable gate array (FPGA) IC from Intel designed for applications that require high logic density, abundant on-chip memory, and extensive I/O. It implements the Stratix IV E device family architecture as described in the device handbook, including FPGA fabric, embedded memory, DSP resources and advanced I/O features.
With 531,200 logic elements, approximately 28 Mbits of embedded memory and 1,120 I/O, this device targets high-bandwidth communications, complex signal processing and system integration roles where integration and flexible programmable logic are key. It is supplied in a 1760-FCBGA surface-mount package and rated for commercial temperature operation.
Key Features
- Core capacity — 531,200 logic elements provide substantial programmable logic resources for complex designs and high gate-count implementations.
- Embedded memory — Total on-chip RAM of 28,033,024 bits (approximately 28 Mbits) for buffering, frame storage, and local data structures.
- Rich I/O — 1,120 user I/O pins support extensive external interfacing and system connectivity.
- Stratix IV E architecture — Device handbook sections describe FPGA fabric, clock networks, PLLs, DSP blocks and external memory interface support as part of the Stratix IV E family architecture.
- High‑speed I/O and transceivers — The Stratix IV device handbook highlights high-speed differential I/O and transceiver features suited to protocol and bandwidth-driven designs.
- Power supply — Core voltage supply range from 870 mV to 930 mV to match system power design requirements.
- Package and mounting — 1760-FCBGA package (42.5 × 42.5 mm) in a surface-mount form factor for dense board integration.
- Commercial grade and temperature — Rated operating temperature 0 °C to 85 °C for commercial applications.
- RoHS compliant — Meets RoHS environmental requirements.
Typical Applications
- High‑bandwidth communications — Implements protocol logic and packet processing using the device’s high-speed I/O and Stratix IV E architecture.
- Signal processing and DSP — Leverages embedded memory and documented DSP block capabilities for digital signal processing pipelines.
- External memory interface controllers — Supports external memory interface designs as described in the device handbook for buffering and system memory access.
- System integration and prototyping — High logic density and large I/O count enable integration of multiple subsystems and rapid design iteration.
Unique Advantages
- High logic density: 531,200 logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
- Substantial on-chip memory: Approximately 28 Mbits of embedded RAM supports large frame buffers, FIFOs and look‑up tables without relying solely on external memory.
- Extensive I/O capability: 1,120 I/Os simplify connections to peripherals, memory devices and high-speed interfaces.
- Architecture-level support: Stratix IV E family documentation highlights integrated clocking, PLLs, DSP resources and high-speed I/O features that aid system designers.
- Compact, manufacturable package: 1760-FCBGA (42.5 × 42.5 mm) surface-mount package supports high-density PCB layouts while meeting commercial manufacturing practices.
- Regulatory and environmental readiness: RoHS compliance supports environmental requirements in product development and procurement.
Why Choose EP4SE530F43C4?
The EP4SE530F43C4 delivers a combination of large programmable fabric, significant embedded memory and broad I/O resources within the Stratix IV E device family architecture. Its documented features—covering FPGA fabric, clocking, DSP blocks, high-speed I/O and external memory interfaces—make it suitable for designs that demand integration of complex logic, signal processing and high-bandwidth connectivity.
This commercial‑grade, RoHS‑compliant FPGA in a 1760‑FCBGA surface‑mount package is well suited for engineering teams building communications equipment, advanced signal-processing systems, and integrated prototypes that require both capacity and architectural flexibility.
Request a quote or submit an inquiry to get pricing and availability for the EP4SE530F43C4. Our team can provide lead-time information and support your procurement needs.

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