EP4SE530F43C4

IC FPGA 1120 I/O 1760FCBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 1120 28033024 531200 1760-BBGA, FCBGA

Quantity 78 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O1120Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SE530F43C4 – STRATIX® IV E FPGA, 531,200 logic elements, 1760-FCBGA

The EP4SE530F43C4 is a Stratix IV E field-programmable gate array (FPGA) IC from Intel designed for applications that require high logic density, abundant on-chip memory, and extensive I/O. It implements the Stratix IV E device family architecture as described in the device handbook, including FPGA fabric, embedded memory, DSP resources and advanced I/O features.

With 531,200 logic elements, approximately 28 Mbits of embedded memory and 1,120 I/O, this device targets high-bandwidth communications, complex signal processing and system integration roles where integration and flexible programmable logic are key. It is supplied in a 1760-FCBGA surface-mount package and rated for commercial temperature operation.

Key Features

  • Core capacity — 531,200 logic elements provide substantial programmable logic resources for complex designs and high gate-count implementations.
  • Embedded memory — Total on-chip RAM of 28,033,024 bits (approximately 28 Mbits) for buffering, frame storage, and local data structures.
  • Rich I/O — 1,120 user I/O pins support extensive external interfacing and system connectivity.
  • Stratix IV E architecture — Device handbook sections describe FPGA fabric, clock networks, PLLs, DSP blocks and external memory interface support as part of the Stratix IV E family architecture.
  • High‑speed I/O and transceivers — The Stratix IV device handbook highlights high-speed differential I/O and transceiver features suited to protocol and bandwidth-driven designs.
  • Power supply — Core voltage supply range from 870 mV to 930 mV to match system power design requirements.
  • Package and mounting — 1760-FCBGA package (42.5 × 42.5 mm) in a surface-mount form factor for dense board integration.
  • Commercial grade and temperature — Rated operating temperature 0 °C to 85 °C for commercial applications.
  • RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

  • High‑bandwidth communications — Implements protocol logic and packet processing using the device’s high-speed I/O and Stratix IV E architecture.
  • Signal processing and DSP — Leverages embedded memory and documented DSP block capabilities for digital signal processing pipelines.
  • External memory interface controllers — Supports external memory interface designs as described in the device handbook for buffering and system memory access.
  • System integration and prototyping — High logic density and large I/O count enable integration of multiple subsystems and rapid design iteration.

Unique Advantages

  • High logic density: 531,200 logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
  • Substantial on-chip memory: Approximately 28 Mbits of embedded RAM supports large frame buffers, FIFOs and look‑up tables without relying solely on external memory.
  • Extensive I/O capability: 1,120 I/Os simplify connections to peripherals, memory devices and high-speed interfaces.
  • Architecture-level support: Stratix IV E family documentation highlights integrated clocking, PLLs, DSP resources and high-speed I/O features that aid system designers.
  • Compact, manufacturable package: 1760-FCBGA (42.5 × 42.5 mm) surface-mount package supports high-density PCB layouts while meeting commercial manufacturing practices.
  • Regulatory and environmental readiness: RoHS compliance supports environmental requirements in product development and procurement.

Why Choose EP4SE530F43C4?

The EP4SE530F43C4 delivers a combination of large programmable fabric, significant embedded memory and broad I/O resources within the Stratix IV E device family architecture. Its documented features—covering FPGA fabric, clocking, DSP blocks, high-speed I/O and external memory interfaces—make it suitable for designs that demand integration of complex logic, signal processing and high-bandwidth connectivity.

This commercial‑grade, RoHS‑compliant FPGA in a 1760‑FCBGA surface‑mount package is well suited for engineering teams building communications equipment, advanced signal-processing systems, and integrated prototypes that require both capacity and architectural flexibility.

Request a quote or submit an inquiry to get pricing and availability for the EP4SE530F43C4. Our team can provide lead-time information and support your procurement needs.

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