EP4SE530F43C3NES

The EP4SE530F43C3NES is a Stratix IV E FPGA in a 1760-FCBGA (42.5×42.5 mm) package, offering high-density logic and on-chip memory for complex digital designs. This commercial-grade, surface-mount device targets applications that require large logic capacity, substantial embedded RAM, and extensive I/O connectivity while operating within standard commercial temperature and supply ranges.

Device documentation for the Stratix IV family highlights architecture features such as embedded memory, DSP blocks, clock networks, PLLs and high-speed I/O—capabilities applicable to designs that demand high aggregate data bandwidth and flexible protocol support.

Key Features

• Logic Capacity  Provides 531,200 logic elements to implement large-scale digital logic and complex state machines.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM (28,033,024 total RAM bits) for local buffering, LUT-based storage, and memory-mapped designs.
• I/O Density  1120 user I/O pins to support broad device interfacing, parallel buses, and mixed-signal I/O requirements.
• Power Supply  Operates from a core voltage supply range of 870 mV to 930 mV, enabling predictable power budgeting for the FPGA core.
• Package & Mounting  1760-FCBGA package (42.5×42.5 mm) in a surface-mount form factor for high-density PCB integration.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Standards Compliance  RoHS compliant for regulatory environmental requirements.
• Stratix IV Family Features  Device handbook references architecture-level features including DSP blocks, PLLs, clock networks, external memory interfaces and high-speed transceiver support relevant to the Stratix IV E family.

Typical Applications

• Communications & Networking  High I/O count and family-level support for high-speed transceivers make this FPGA suitable for protocol bridging, packet processing, and high-throughput interfaces.
• Signal Processing & DSP  Large logic density and the Stratix IV family’s DSP block architecture support compute-intensive signal processing tasks and algorithm acceleration.
• High-performance Prototyping  Significant logic and memory resources accommodate complex SoC prototyping, hardware emulation, and verification platforms.

Unique Advantages

• High integration in a single device:  531,200 logic elements with approximately 28 Mbits of embedded memory reduce external component count and simplify board design.
• Extensive I/O connectivity:  1120 I/O pins give designers flexibility for wide parallel buses, multiple interfaces, and dense connector layouts.
• Compact, manufacturable package:  1760-FCBGA surface-mount package (42.5×42.5 mm) provides a high-pin-count solution optimized for production PCBs.
• Predictable power envelope:  Documented core supply range (870 mV–930 mV) supports consistent power planning and supply design.
• Documented architecture support:  Stratix IV device handbook details architecture-level features—embedded memory, DSP blocks, PLLs, clock networks and high-speed I/O—helping design teams map system requirements to device capabilities.
• Regulatory compliance:  RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP4SE530F43C3NES?

The EP4SE530F43C3NES positions itself as a high-density, commercially graded Stratix IV E FPGA that consolidates large logic capacity, substantial embedded RAM, and high I/O count in a production-friendly FCBGA package. It is well suited to development teams and systems that require significant on-chip resources along with documented family-level features such as DSP blocks, PLLs and high-speed I/O support.

For projects demanding scalable performance, predictable power requirements, and a documented architecture reference, this device offers the integration needed to reduce external components and simplify system design while adhering to commercial temperature and regulatory constraints.

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